Polyimide Dome Isolation Layer for Process Chamber Thermal Stress
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Solution Overview
Problem
Conventional spacers in semiconductor process chambers deform under repeated heating and cooling, leading to increased heat transfer and mechanical stresses, resulting in higher maintenance costs and reduced effectiveness over time.
Innovation Solution
An insulating layer made of polyimide material is placed between the dome assembly and the annular gas ring in the process chamber, providing thermal insulation and mechanical isolation, reducing thermal energy transfer and mechanical stresses while preventing deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If PTFE spacers are used to create physical separation between adjacent components, then heat transfer between components is reduced, but the spacers deform under repeated heating and cooling, leading to increased maintenance costs and reduced reliability
Solution Approach 1:
The patent changes the material parameter from PTFE to a composite material consisting of an inert flexible polymer matrix with embedded inert particles. This parameter change allows the spacer to maintain its dimensional stability and resistance to deformation under repeated thermal cycling while still providing effective thermal insulation, thus resolving the contradiction between reducing heat transfer and maintaining reliability.
Solution Approach 2:
The patent employs a composite material structure where an inert flexible polymer matrix is combined with embedded inert particles. This composite approach provides both the flexibility needed for thermal isolation and the structural integrity to resist deformation under repeated heating and cooling, thereby solving the reliability issue while maintaining the heat transfer reduction benefit.
2Reliability
If conventional spacers are used for mechanical isolation, then initial thermal isolation is achieved, but the spacers fail over time due to deformation, resulting in increased maintenance costs
Solution Approach 1:
The patent modifies the material parameters by using a flexible polymer matrix with embedded inert particles instead of conventional PTFE. This parameter change enhances the spacer's resistance to thermal deformation and mechanical stress, allowing it to maintain effective thermal isolation over extended periods and significantly increasing the maintenance interval.
Solution Approach 2:
The patent avoids the need for frequent replacement of spacers by using a durable composite material. Instead of relying on short-lived conventional spacers that require regular maintenance, the improved spacer design provides long-term reliability, reducing maintenance frequency and associated costs.
3Temperature
If chamber components are actively cooled, then temperature control is improved, but heat transfer to adjacent components increases, requiring additional cooling mechanisms
Solution Approach 1:
The patent introduces an inert flexible polymer spacer as an intermediary material between actively cooled components and adjacent chamber components. This intermediary provides thermal isolation that prevents heat transfer from the cooled components to adjacent parts, thereby improving temperature control efficiency and reducing the energy required for cooling without requiring additional cooling mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The polyimide insulating layer effectively reduces heat transfer and mechanical stresses between the dome assembly and the gas ring, extending the lifespan of the chamber components and lowering maintenance costs by maintaining thermal isolation and mechanical separation.
Implementation Method 1
An insulating layer made of polyimide material is placed between the dome assembly and the annular gas ring in the process chamber, providing thermal insulation and mechanical isolation, reducing thermal energy transfer
Implementation Method 2
Film deposition is generally accomplished by introducing process gasses into a process chamber that contains the substrate. The process gasses are activated, for example, by heat, within the process chamber.
Data Source
AI summary
Embodiments described herein relate to apparatus and techniques for mechanical isolation and thermal insulation in a process chamber. In one embodiment, an insulating layer is disposed between a dome assembly and a gas ring. The insulating layer is configured to maintain a temperature of the dome assembly and prevent thermal energy transfer from the dome assembly to the gas ring. The insulating layer provides mechanical isolation of the dome assembly from the gas ring. The insulating layer also provides thermal insulation between the dome assembly and the gas ring. The insulating layer may be fabricated from a polyimide containing material, which substantially reduces an occurrence of deformation of the insulating layer.