Ultra-High Modulus Polyimide Film for Flexible Displays

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Solution Overview

Problem

Conventional transparent polyimide materials exhibit insufficient mechanical performance despite desirable optical properties, necessitating the development of ultra-high modulus and high-transmittance polyimide thin films for advanced electronics and flexible displays.

Innovation Solution

A polyimide thin film is prepared by mixing and dissolving specific polydiamine and polydianhydride in a solvent, adding an end-capping reagent, and performing polymerization and imidization, with the use of a bidirectional synchronous stretching machine to enhance mechanical strength while maintaining high transmittance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If conventional transparent polyimide materials are used, then high transmittance is achieved, but mechanical performance (modulus) is insufficient

Engineering Contradiction:
Improvemechanical performanceVSAvoidtransmittance
Core Design Contradiction:
StrengthVSIllumination intensity

Solution Approach 1:

The patent employs composite material design by combining polyimide with specific additives and utilizing multi-component monomer systems (diamine and dianhydride combinations) to create a material that simultaneously achieves high transmittance (>75%) and ultra-high modulus (>8 GPa). The composite approach allows optimization of both optical and mechanical properties that cannot be achieved with single-component polyimide alone.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent systematically varies compositional parameters including the ratios of different diamine and dianhydride monomers, solvent types and concentrations, and curing conditions to optimize the balance between transmittance and modulus. By adjusting these parameters, the material achieves the dual performance target of >75% transmittance and >8 GPa elastic modulus.

Inventive Principle:
Principle #35Parameter changes

2Strength

If polyimide thin films are designed for high modulus to avoid deformation during processing, then mechanical strength is improved, but optical transmittance may be compromised

Engineering Contradiction:
ImprovemodulusVSAvoidtransmittance
Core Design Contradiction:
StrengthVSIllumination intensity

Solution Approach 1:

The patent applies local quality optimization by carefully selecting specific functional groups and molecular structures in different regions of the polymer chain. The diamine and dianhydride monomers are chosen to create local structural characteristics that simultaneously enhance mechanical rigidity while maintaining optical clarity, achieving >8 GPa modulus without sacrificing transmittance.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent optimizes processing parameters including solvent selection, concentration, casting conditions, and thermal curing profiles to achieve the desired balance between modulus and transmittance. By controlling these parameters, the film formation process preserves optical properties while developing the required mechanical strength.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The resulting polyimide thin film achieves transmittance greater than 75% and an elastic modulus greater than 8 GPa, providing excellent mechanical strength suitable for flexible displays and aerospace applications.

Implementation Method 1

mixing and dissolving polydiamine and polydianhydride in a solvent, adding an end-capping reagent, and performing polymerization reaction and imidization

Methodology Applied
Scientific EffectPolymerization reaction: Chemical Bonding

Implementation Method 2

performing imidization and purification on the polyamic acid solution, so as to obtain a polyimide prepolymer

Methodology Applied
Scientific EffectImidization: Chemical Bonding

Implementation Method 3

with the use of a bidirectional synchronous stretching machine to enhance mechanical strength while maintaining high transmittance

Methodology Applied
Scientific EffectMechanical stretching: Mechanical Force

Data Source

PatentUS20230303786A1Ultra-high modulus and high-transmittance polyimide thin film, and preparation method and application therefor
Publication Date: 2023.09.28 RAYITEK HI TECH FILM CO LTD

AI summary

Disclosed in the present disclosure are an ultra-high modulus and high-transmittance polyimide thin film, and a preparation method and application therefor. The ultra-high modulus and high-transmittance polyimide thin film is prepared by means of mixing and dissolving polydiamine and polydianhydride in a solvent, adding an end-capping reagent, and performing polymerization reaction and imidization. The ultra-high modulus and high-transmittance polyimide thin film has an ultra-high modulus and high transmittance, and is applicable to fields such as flexible photoelectricity and aerospace, especially to a structural member, a reinforcement layer or a substrate of flexible display and transparent display.