Polyimide Film Adhesion via UV Surface Modification
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Solution Overview
Problem
Polyimide resin films exhibit unsatisfactory adhesiveness between layers, leading to peeling issues when used in multilayered configurations, particularly in applications like image forming apparatuses, where improved adhesion is crucial for maintaining performance and preventing resistance variations.
Innovation Solution
A polyimide resin film configuration with a first layer having a bond composition ratio of C—N and C—O bonds of 4 atm% or more, enhanced by a second layer, which improves adhesiveness without requiring additional functional layers or surface treatments like sandblasting, achieved through surface improving treatments such as ultraviolet irradiation and subsequent removal of degraded imide resin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If polyimide resin layers are applied in a superimposed manner in a precursor dried state, then adhesiveness between layers is improved, but surface erosion occurs at the interface when contacted with solvent
Solution Approach 1:
The patent applies preliminary surface treatment to the polyimide resin layers before lamination. Specifically, the surface is irradiated with ultraviolet light or subjected to plasma treatment to create a roughened surface or introduce polar groups, which enhances adhesion without requiring subsequent solvent contact that would cause erosion. This preliminary modification of surface properties resolves the contradiction by achieving good adhesiveness without the harmful erosion effect.
Solution Approach 2:
The patent changes the surface energy and chemical composition parameters of the polyimide resin through surface treatment. By controlling the surface treatment conditions (UV irradiation time, plasma power, etc.), the surface is modified to have improved wettability and chemical reactivity, enabling strong adhesion between layers without requiring aggressive solvent contact that would cause surface erosion.
2Strength
If chemical or physical treatment is performed on polyimide resin layers to improve adhesiveness, then adhesiveness is improved, but process complexity increases
Solution Approach 1:
The patent replaces complex chemical treatments with simpler physical treatments. Instead of using chemical etchants or multi-step chemical processes, the invention uses ultraviolet light irradiation or plasma treatment, which are physically-based methods that achieve surface modification without requiring complex chemical handling, equipment, or safety measures, thus reducing process complexity while maintaining improved adhesiveness.
Solution Approach 2:
The patent optimizes the parameters of physical surface treatment (UV intensity, exposure time, plasma power) to achieve effective adhesion improvement with minimal process complexity. By carefully controlling these parameters, the treatment becomes a simple, repeatable process that does not require complex equipment or multiple steps, resolving the contradiction between adhesiveness improvement and process complexity.
3Strength
If multiple surface treatment steps are applied to improve adhesion, then adhesiveness is improved, but manufacturing time increases
Solution Approach 1:
The patent combines surface treatment and lamination into a single integrated process step. The polyimide resin layers are surface-treated and then immediately laminated without intermediate drying or handling steps, merging what would otherwise be separate operations. This integration maintains strong adhesion while minimizing the total manufacturing time by eliminating idle time between treatment and bonding.
Solution Approach 2:
The patent performs surface treatment in advance during the lamination preparation phase, so that when the layers are brought into contact, adhesion occurs immediately without requiring additional treatment steps afterward. This preliminary modification of surface properties ensures that the bonding process itself is rapid and does not require extended processing time, thus improving adhesiveness without significantly increasing manufacturing time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The configuration significantly enhances the adhesiveness between the layers, preventing peeling and maintaining the integrity of the polyimide resin film, even under the stress of continuous use in applications like image forming apparatuses, while maintaining the surface properties of the first layer.
Implementation Method 1
the surface of the polyimide resin is subjected to a photochemical reaction treatment by bringing the polyimide resin into contact with an aqueous solution of hydrogen peroxide, then bringing the polyimide resin into contact with an aqueous solution of an iron salt while irradiating the polyimide resin with an ultraviolet ray
Implementation Method 2
the surface after being subjected to the photochemical reaction treatment is then etched with a salt of permanganic acid, thereby forming an uneven surface
Data Source
AI summary
A polyimide resin film includes: a first layer that contains an imide resin, a bond composition ratio of a sum of a C—N bond and a C—O bond to bonds of all C elements that are present in a surface of the first layer being 4 atm % or more; and a second layer that is provided on the surface of the first layer.