Polyimide Layer Bonding for Acceleration Sensor Substrates
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Solution Overview
Problem
The existing acceleration sensor technology faces challenges in maintaining consistent adhesive thickness and preventing void formation, leading to variations in the distance between the weight and polyimide layers, which affects the accuracy of acceleration detection and durability.
Innovation Solution
The solution involves using cured polyimide layers with uniform thicknesses that are thermocompression-bonded together, eliminating the need for adhesives and ensuring a constant distance between substrates, thus preventing voids and enhancing bonding strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive is applied to bond polyimide layers, then the layers can be joined together, but the adhesive thickness varies and voids form, leading to inconsistent distances between substrates
Solution Approach 1:
The invention extracts and eliminates the adhesive layer from the bonding process. Instead of using adhesive to bond polyimide layers, the patent directly bonds the polyimide layers to each other through heat treatment, removing the source of thickness variation and void formation entirely.
Solution Approach 2:
The patent introduces heat treatment as an intermediary mechanism to enable direct bonding between polyimide layers. By applying heat, the polyimide layers become pliable and bond directly without requiring adhesive, achieving both strong bonding and consistent thickness.
2Strength
If adhesive is used to join substrates, then bonding is achieved, but voids form during curing, reducing reliability
Solution Approach 1:
The invention removes the adhesive material from the system entirely, eliminating the curing process that causes void formation. The polyimide layers bond directly through heat treatment without any intermediate adhesive layer that could trap voids during curing.
3Strength
If adhesive application is performed, then substrates can be joined, but the process becomes complex and difficult to control
Solution Approach 1:
The invention extracts the adhesive application step from the bonding process. By eliminating adhesive entirely, the complex steps of adhesive dispensing, positioning, and curing are replaced with a simple heat treatment process that directly bonds the polyimide layers.
Solution Approach 2:
The polyimide layers bond to each other through their own material properties when heated, without requiring external adhesive materials. The heat treatment causes the polyimide layers to become pliable and bond directly, making the bonding process self-contained and simpler.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the reliability and durability of the acceleration sensor by maintaining precise distances and reducing variations in performance, while avoiding issues related to adhesive application and void formation.
Implementation Method 1
The first and second polyimide layers are joined together by being pressed on each other and being heated to a bonding temperature
Data Source
AI summary
An element structure has a polyimide resin applied on a surface of a first substrate to a uniform thickness, and is subsequently heated to form a semi-cured polyimide layer. The polyimide layer is then cured to form a cured first polyimide layer. A polyimide resin is applied on a surface of a second substrate to a uniform thickness, and is subsequently heated to form a semi-cured polyimide layer. The polyimide layer is then cured to form a cured second polyimide layer. The cured first and second polyimide layers are pressed on each other and heated to a bonding temperature, thereby joining the polyimide layers together. Thus, the first substrate and the second substrate are combined with the polyimide layer being the bonded structure of the polyimide layers therebetween.