Polyimide Layer Composition Control in Thin Semiconductor Films
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Solution Overview
Problem
There is a need for improved control over the composition of thinner organic polymer layers in semiconductor manufacturing, as the composition of deposited organic polymer material can be influenced by the substrate surface, leading to variations in properties such as thermal stability and mechanical resistance, which are critical as semiconductor chip sizes shrink.
Innovation Solution
A method involving the use of a reaction chamber where a first polymer precursor with acid anhydride groups and a second polymer precursor with amine groups are vapor-deposited alternately, followed by a modifying agent to increase the proportion of polyimide in the organic polymer, reducing the polyamic acid content and forming a modified organic polymer layer with enhanced properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If vapor phase deposition is used to form thin organic polymer layers, then film thickness is reduced, but composition control deteriorates due to substrate surface effects
Solution Approach 1:
The patent applies preliminary action by introducing a modifying agent in vapor phase before the final polymer deposition step. This modifying agent pre-conditiones the substrate surface to reduce its influence on subsequent polymer composition, thereby enabling better composition control in thinner films. The modifying agent creates a controlled intermediate layer that mediates between the substrate and the polymer precursor, reducing substrate-induced composition variations.
2Ease of manufacture
If polyamic acid content is high in deposited organic polymer, then deposition process is simpler, but thermal stability and mechanical resistance deteriorate
Solution Approach 1:
The patent uses a modifying agent as an intermediary substance that reacts with polyamic acid groups in the deposited polymer. This modifying agent facilitates the conversion of polyamic acid to polyimide through chemical reaction, thereby improving thermal stability and mechanical resistance. The modifying agent acts as a mediator that transforms the polymer composition in-situ without requiring complete process reconfiguration, maintaining ease of manufacture while enhancing reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the formation of modified organic polymer layers with reduced polyamic acid content, resulting in improved thermal stability and mechanical resistance, suitable for advanced semiconductor applications by enhancing the proportion of polyimide, thus addressing the challenge of substrate-dependent composition variations.
Implementation Method 1
providing a first polymer precursor into the reaction chamber in a vapor phase and providing a second polymer precursor into the reaction chamber in a vapor phase to deposit an organic polymer
Implementation Method 2
Vapor phase deposition processes such as chemical vapor deposition (CVD), vapor deposition polymerization (VDP)
Implementation Method 3
providing a modifying agent into the reaction chamber in a vapor phase to increase the proportion of polyimide in the organic polymer on the substrate
Data Source
AI summary
The disclosure relates to methods of forming organic polymers comprising polyimide and layers comprising the same and to methods of reducing polyamic acid content of an organic polymer. The embodiments of the disclosure further relate to methods of fabricating semiconductor devices, to selectively depositing a material on a surface of a semiconductor substrate and to semiconductor processing assemblies. The methods are characterized by contacting a polyimide-containing material, such as a layer, with a modifying agent that increases the proportion of polyimide in the organic polymer material.