Polyimide Resin Composition for Low-k and Low Thermal Expansion
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Solution Overview
Problem
Existing polyimide resins for high-frequency substrates face a challenge in simultaneously achieving a low dielectric constant and a low linear expansion coefficient, as these properties are generally in a trade-off relationship.
Innovation Solution
A polyimide resin composition comprising specific acid anhydrides and diamines, defined by certain chemical formulas, which are optimized through molecular dynamics simulation to achieve a low dielectric constant and low linear expansion coefficient, characterized by specific free volume fraction and average neighboring atom number.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If polyimide resin is designed to achieve low dielectric constant, then dielectric constant is reduced, but linear expansion coefficient increases
Solution Approach 1:
The patent changes the chemical structure parameters of the polyimide resin by introducing specific fluorinated cyclic structures and controlling the ratio of aromatic to aliphatic components. This structural parameter modification enables simultaneous reduction of dielectric constant to 2.6 or less and linear expansion coefficient to 50 ppm/K or less, resolving the trade-off relationship between these two properties.
Solution Approach 2:
The patent creates a composite molecular structure within the polyimide resin by combining fluorinated cyclic acid anhydride units with specific diamine units. This composite approach at the molecular level allows the material to exhibit both low dielectric constant and low linear expansion coefficient properties that cannot be achieved with single-structure polyimides.
2Stability of the object's composition
If polyimide resin is designed to achieve low linear expansion coefficient, then linear expansion coefficient is reduced, but dielectric constant increases
Solution Approach 1:
The patent modifies the molecular structure parameters by incorporating fluorinated cyclic structures and controlling the aromatic/aliphatic ratio. This structural change simultaneously achieves low linear expansion coefficient (50 ppm/K or less) and low dielectric constant (2.6 or less), overcoming the inverse relationship between these properties.
Solution Approach 2:
The patent employs a composite molecular architecture combining fluorinated cyclic acid anhydride units with specific diamine units. This composite structure enables the polyimide resin to exhibit both low thermal expansion and low dielectric constant properties, resolving the contradiction between these two characteristics.
Data Source
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AI summary
A polyimide resin for a high-frequency substrate material includes an acid anhydride and a diamine. The acid anhydride is one or more selected from the group consisting of compounds represented by general formula (A-1) below, and the diamine is one or more selected from the group consisting of compounds represented by general formula (B-1) below and compounds represented by general formula (B-2) below: and