Polyimide Resin Low-Temperature Imidization

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Solution Overview

Problem

Conventional methods for producing polyimide resin at lower temperatures result in degraded heat resistance and mechanical properties, and increased dielectric constant, limiting their application to heat-sensitive materials.

Innovation Solution

Heating a polyamic acid solution, formed from a reaction of a tetracarboxylic acid dianhydride component and a diamine component in N,N,N′,N′-tetramethylurea, at temperatures between 120° C to 350° C to produce a polyimide resin with improved heat resistance and mechanical properties while maintaining a low dielectric constant.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If heat-treatment at high temperature (about 300°C) is performed to produce polyimide resin, then heat resistance and mechanical properties are improved, but the method cannot be applied to heat-sensitive materials

Engineering Contradiction:

Improveheat resistance and mechanical propertiesVSAvoidapplicability to heat-sensitive materials

Core Design Contradiction:

StrengthVSAdaptability or versatility

Solution Approach 1:

The patent changes the chemical composition parameters of the polyamic acid precursor by selecting specific tetracarboxylic acid dianhydride and diamine combinations, which enables successful imidization at lower temperatures (100-200°C) while maintaining polyimide resin quality, thus resolving the contradiction between heat resistance and applicability to heat-sensitive materials

Inventive Principle:

Principle #35Parameter changes

2Adaptability or versatility

If heat-treatment at lower temperature (around 200°C) is performed to apply to heat-sensitive materials, then adaptability is improved, but heat resistance and mechanical properties degrade and dielectric constant increases

Engineering Contradiction:

Improveapplicability to heat-sensitive materialsVSAvoidheat resistance and mechanical properties

Core Design Contradiction:

Adaptability or versatilityVSStrength

Solution Approach 1:

The patent optimizes the chemical parameters of the polyamic acid precursor through specific monomer selection and ratios, enabling low-temperature imidization to proceed effectively while producing polyimide resin with excellent heat resistance and mechanical properties, thus resolving the contradiction between adaptability and strength

Inventive Principle:

Principle #35Parameter changes

3Ease of operation

If heat-treatment at lower temperature is performed, then ease of operation is improved, but dielectric constant increases

Engineering Contradiction:

Improveprocessing easeVSAvoiddielectric constant

Core Design Contradiction:

Ease of operationVSReliability

Solution Approach 1:

The patent changes the chemical composition parameters of the polyamic acid precursor to enable complete and controlled imidization at lower temperatures, producing polyimide resin with low dielectric constant, thus resolving the contradiction between ease of operation and reliability

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables the production of polyimide resin with excellent heat resistance and mechanical properties, including tensile elongation, and a low dielectric constant, even when heat-treated at lower temperatures, effectively addressing the limitations of conventional methods.

Implementation Method 1

heating at from 120° C. to 350° C. a polyamic acid resulting from the reaction of a tetracarboxylic acid dianhydride component and a diamine component

Methodology Applied

Scientific EffectThermal imidization: Phase Change

Data Source

PatentUS9458355B2Method of producing polyimide resin, method of producing polyimide coating, method of producing polyamic acid solution, polyimide coating, and polyamic acid solution

Publication Date: 2016.10.04 TOKYO OHKA KOGYO CO LTD

AI summary

A polyimide resin produced by heating a polyamic acid resulting from the reaction of a tetracarboxylic acid dianhydride component and a diamine component in N,N,N′,N′-tetramethylurea.