Polyimide-Metal Laminate Adhesion via Imidization
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Solution Overview
Problem
Current polyimide-metal laminates face challenges with insufficient heat resistance and adhesiveness, particularly when laminating metal foils on both sides of a polyimide film, limiting their application in electronic and semiconductor devices.
Innovation Solution
A method involving the formation of polyimide films using a tetracarboxylic dianhydride component and a diamine compound, specifically 2,4-bis(4-aminoanilino)-6-anilino-1,3,5-triazine, followed by thermal compression-bonding to achieve excellent adhesiveness and heat resistance between the polyimide film and metal layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a polyimide film is laminated with a metal layer via an adhesive layer, then the laminate can be produced, but the heat resistance and adhesiveness are insufficient
Solution Approach 1:
The invention changes the chemical composition parameters of the polyimide by incorporating specific diamine compounds (formula 1) with adjustable R1 and R2 groups. This allows tuning of the polyimide's thermal and adhesive properties to achieve both high heat resistance and excellent adhesiveness without being limited to specific thermally compression-bondable materials
Solution Approach 2:
The invention creates a composite polyimide structure by combining tetracarboxylic dianhydride with diamine compounds of formula (1), forming a new material system that integrates both heat resistance and adhesiveness functions within the polyimide itself, eliminating the need for separate adhesive layers
2Reliability
If thermal compression-bonding is used to laminate polyimide with metal foil, then heat resistance and adhesiveness are improved, but the material selection is limited
Solution Approach 1:
By modifying the diamine compound structure (formula 1) with different R1 and R2 groups, the invention creates a series of polyimide variants that can be optimized for different applications while maintaining compatibility with thermal compression-bonding, thus expanding material selection beyond single specific materials
Solution Approach 2:
The polyimide of formula (1) serves multiple functions simultaneously: it provides the base film structure, ensures thermal stability, and enables strong metal adhesion through its chemical composition, making it universally applicable for thermal compression-bonding with various metal foils
3Strength
If metal layers are laminated on both sides of a polyimide film, then the laminate structure is formed, but adhesiveness at the interface remains insufficient
Solution Approach 1:
The invention optimizes the chemical parameters of the polyimide by selecting specific diamine compounds with adjustable substituents (R1, R2), creating a material composition that simultaneously achieves high interface adhesiveness and maintains excellent heat resistance at the polyimide-metal interface
Solution Approach 2:
The polyimide composition is designed to have enhanced adhesive properties specifically at the surface regions that contact the metal layers, while maintaining bulk heat resistance properties, achieving local optimization of both adhesiveness and thermal stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method results in polyimide-metal laminates with enhanced adhesiveness and heat resistance, enabling effective lamination of metal foils on both sides of the polyimide film, suitable for advanced electronic and semiconductor applications.
Implementation Method 1
imidizing the self-supporting film by heating at a maximum heating temperature of 440° C. or lower to form the polyimide layer (a)
Implementation Method 2
thermal compression-bonding metal layers on both sides of the polyimide film
Data Source
AI summary
A method for manufacturing a polyimide-metal laminate including forming a polyimide film, in which at least surfaces of both sides of the film are formed by thermally fusion-bondable polyimide layers (a), and thermal compression-bonding metal layers on both sides of the polyimide film; in which forming the polyimide film includes reacting a tetracarboxylic dianhydride component with a diamine component containing a diamine compound represented by general formula (1) to give a solution of a polyamic acid (a), forming a self-supporting film from the solution of the polyamic acid (a) and imidizing the self-supporting film by heating at a maximum heating temperature of 440° C. or lower to form the polyimide layer (a);in which R1 represents hydrogen or alkyl or aryl having 1 to 12 carbon atoms; and R2 represents hydrogen or alkyl or aryl having 1 to 12 carbon atoms.