Polyimide Plating Target for Fine Wiring Adhesion
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Solution Overview
Problem
Electroless plating on insulative materials, particularly for printed-wiring boards, faces challenges with low adhesiveness due to smooth surfaces and small surface roughness, requiring surface roughening which limits fine wiring formation.
Innovation Solution
A plating-target material with a polyimide resin layer having specific structures and properties, including low surface roughness and defined adhesive force, is used to enhance adhesiveness to electroless plating films without the need for surface roughening, serving as an interlayer adhesive for improved electroless plating on smooth surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If surface roughening is applied to improve adhesiveness, then adhesive force between electroless plating film and insulative material is improved, but surface roughness increases which limits fine wiring formation
Solution Approach 1:
The patent changes the chemical composition parameters of the polyimide resin by incorporating specific diamine components (aromatic diamines, alicyclic diamines, or aliphatic diamines) to achieve optimal adhesiveness without surface roughening. This chemical parameter modification allows the resin to provide sufficient bonding strength while maintaining a smooth surface suitable for fine wiring formation.
Solution Approach 2:
The patent creates a composite polyimide resin system by combining multiple types of diamine components (aromatic, alicyclic, and/or aliphatic) with acid dianhydride components. This composite material approach achieves synergistic effects that provide both high adhesiveness to electroless plating films and smooth surface characteristics for fine wiring, resolving the contradiction between strength and manufacturing precision.
2Manufacturing precision
If surface roughness is kept small to enable fine wiring formation, then fine wiring can be formed, but adhesiveness between electroless plating film and insulative material becomes low
Solution Approach 1:
The patent modifies the chemical composition parameters of the polyimide resin by incorporating specific diamine components (aromatic diamines, alicyclic diamines, or aliphatic diamines) to achieve optimal adhesiveness without surface roughening. This chemical parameter modification allows the resin to provide sufficient bonding strength while maintaining a smooth surface suitable for fine wiring formation.
Solution Approach 2:
The patent creates a composite polyimide resin system by combining multiple types of diamine components (aromatic, alicyclic, and/or aliphatic) with acid dianhydride components. This composite material approach achieves synergistic effects that provide both high adhesiveness to electroless plating films and smooth surface characteristics for fine wiring, resolving the contradiction between strength and manufacturing precision.
Data Source
AI summary
A laminate of the present invention comprises a plating-target material including a layer-A, that is subjected to electroless copper plating and has a surface roughness such that an arithmetic mean roughness Ra measured at a cutoff value of 0.002 mm is less than 0.5 μm. The 90° anti-peeling adhesive force of the layer-A is 1.0 N/25 mm or less. Furthermore, the layer-A includes a polyimide resin having a siloxane structure formed by polymerizing a diamine component having a structure represented by Formula (6)in a content of 5 to 95 mol % based on the entire diamine component. A sheet containing the layer-A has an elongation modulus of 1.8 GPa or less. The plating-target material of the present invention has a high adhesiveness to an electroless plating film formed on its surface, even if the surface is not so rough, and it is possible to favorably form electroless plating on the entire surface. Accordingly, the plating-target material and laminate of the present invention is suitably applicable to manufacturing of a printed-wiring board and the like.