Photosensitive Polyimide-Polybenzoxazole Passivation Layer
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Solution Overview
Problem
Highly integrated semiconductor devices with reduced capacitor area are prone to external influences, leading to read errors and operational defects due to insufficient capacitance, necessitating a reliable passivation layer to enhance reliability.
Innovation Solution
A composition comprising a mixed polymer resin of polyimide and polybenzoxazole, along with a photoactive compound and cross-linking agent, is used to form a passivation layer, which is then patterned and baked to create a stable and uniform layer that protects semiconductor devices from external factors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the capacitor area is reduced to achieve high integration, then the device density is improved, but the capacitance decreases making the device vulnerable to external factors
Solution Approach 1:
The patent uses a composite polymer material consisting of polyimide and polybenzoxazole blended together in specific proportions (30-70 wt% polyimide and 20-70 wt% polybenzoxazole). This composite structure combines the high dielectric constant and thermal stability of polyimide with the chemical resistance and mechanical strength of polybenzoxazole, creating a passivation layer that provides sufficient capacitance while protecting against external factors like moisture, chemicals, and physical stress.
Solution Approach 2:
The patent optimizes the compositional parameters of the polymer blend, specifically controlling the weight ratio of polyimide to polybenzoxazole within defined ranges. By adjusting these compositional parameters, the patent achieves the desired balance between capacitance (dielectric constant) and reliability (resistance to external factors), allowing the passivation layer to function effectively even with reduced capacitor area.
2Device complexity
If a photosensitive organic material is used for the passivation layer, then the photolithography process can be performed directly without additional photoresist, but the material must simultaneously provide adequate capacitance and protection
Solution Approach 1:
The patent creates a multi-functional passivation layer material that simultaneously serves as the passivation layer, the photoresist for photolithography patterning, and the protective barrier. The polyimide-polybenzoxazole composite contains photoactive compounds that enable direct photolithography processing, eliminating the need for separate photoresist coating and development steps while maintaining adequate capacitance and environmental protection properties.
3Use of energy by moving object
If polyimide is used as the photosensitive organic material, then the material provides good dielectric properties, but it lacks sufficient chemical resistance and mechanical strength
Solution Approach 1:
The patent blends polyimide with polybenzoxazole in optimized proportions to create a composite material that combines the complementary properties of both polymers. Polyimide contributes high dielectric constant and thermal stability, while polybenzoxazole adds enhanced chemical resistance and mechanical strength. The synergistic combination resolves the contradiction between achieving adequate capacitance and providing sufficient protection against external factors.
4Object-affected harmful factors
If polybenzoxazole is used as the photosensitive organic material, then the material provides good chemical resistance, but it has lower dielectric constant and processability issues
Solution Approach 1:
The patent creates a balanced composite system where polybenzoxazole (providing chemical resistance) is blended with polyimide (providing high dielectric constant). The optimized composition ratios ensure that the composite maintains sufficient chemical resistance from the polybenzoxazole component while achieving adequate capacitance through the polyimide contribution, resolving the trade-off between these two properties.
Solution Approach 2:
The patent adjusts the compositional parameters and processing conditions of the polyimide-polybenzoxazole blend to optimize both dielectric properties and processability. By controlling the weight ratios and processing parameters (such as curing temperature and time), the patent achieves a material that is both chemically resistant and sufficiently processable for photolithography applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The passivation layer formed using this composition improves the mechanical and thermal properties of semiconductor devices, reducing read errors and operational defects by providing enhanced protection against external influences.
Implementation Method 1
a photoactive compound... The coating layer may be partially removed to form a coating layer pattern
Implementation Method 2
a cross-linking agent... A baking process may be performed on the coating layer pattern
Implementation Method 3
the composition may further include a silane coupling agent as an additive
Data Source
AI summary
In a composition of forming a passivation layer, the composition includes about 30 to about 60 percent by weight of a mixed polymer resin formed by blending polyamic acid and polyhydroxy amide, about 3 to about 10 percent by weight of a photoactive compound, about 2 to about 10 percent by weight of a cross-linking agent and an organic solvent. The passivation layer formed by using the composition has superior mechanical and physical properties, in which disadvantages of polyimide and polybenzoxazole are compensated by mixing both materials.