Polyimide Precursor Polymer for High-Resolution Patterning
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Solution Overview
Problem
Current photosensitive resin compositions for semiconductor devices face challenges in achieving high resolution and fine pattern formation without impairing mechanical strength, adhesiveness, and heat resistance, particularly in high-density mounting technologies like three-dimensional lamination, due to limitations in solubility and swelling issues during development.
Innovation Solution
A tetracarboxylic acid diester compound is used to produce a polymer of a polyimide precursor that enhances solubility in organic solvents, allowing for high contrast dissolution and reduced swelling, and is incorporated into a negative photosensitive resin composition with a polymerizable unsaturated bonding group for improved resolution and chemical resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a polyamic acid with ester bond is used as photosensitive polyimide, then the post-curing temperature can be reduced, but the resolution in patterning deteriorates due to poor solubility in alkaline aqueous developer
Solution Approach 1:
The patent changes the chemical structure parameters of the polyimide precursor by introducing specific side groups (carboxyl, hydroxyl, or amine groups) at defined positions relative to the imide ring. This structural modification enables the resin to be soluble in alkaline aqueous developers while maintaining the ability to form high-resolution patterns and endure reduced post-curing temperatures.
Solution Approach 2:
The patent creates a composite resin system combining polyamic acid with specific side groups (carboxyl, hydroxyl, or amine) that provides both photosensitivity and enhanced solubility in alkaline developers. This composite structure allows simultaneous achievement of high resolution patterning and low-temperature curing.
2Temperature
If an already imidated solvent-soluble resin is used, then the post-curing temperature is lowered, but the solubility in alkaline aqueous developer is insufficient for high resolution patterning
Solution Approach 1:
The patent modifies the chemical parameters of already imidated resins by introducing specific ionizable side groups (carboxyl, hydroxyl, or amine groups) at controlled positions. This increases the resin's interaction with alkaline aqueous developers, enhancing solubility for high-resolution patterning while preserving low-temperature curing capability.
Solution Approach 2:
The patent introduces specific functional groups at localized positions (side groups at defined positions relative to imide rings) to create regions of enhanced alkaline solubility without compromising the overall structural integrity or curing properties of the polyimide resin.
3Shape
If high aspect ratio patterns are formed, then the film thickness and pattern dimension requirements are met, but the resolution performance is compromised due to swelling during development
Solution Approach 1:
The patent changes the hydrophobicity parameters of the polyimide resin by introducing polar side groups (carboxyl, hydroxyl, or amine groups) that enhance affinity for alkaline aqueous developers. This reduces swelling during development, allowing high aspect ratio patterns to be formed with maintained resolution performance.
Solution Approach 2:
The patent converts the potential harm of reduced solubility (which causes swelling and poor resolution) into a benefit by strategically introducing side groups that enhance alkaline solubility. This increased solubility prevents swelling during development, enabling simultaneous achievement of high aspect ratio and high resolution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the formation of fine patterns with excellent mechanical strength, adhesiveness, and chemical resistance, while maintaining high resolution and reducing swelling during development, thus addressing the limitations of existing technologies.
Implementation Method 1
enhances solubility in organic solvents, allowing for high contrast dissolution
Implementation Method 2
negative photosensitive resin composition with a polymerizable unsaturated bonding group
Data Source
AI summary
The present invention provides a tetracarboxylic acid diester compound represented by the following general formula (1), wherein, X1 represents a tetravalent organic group, and R1 represents a group represented by the following general formula (2), wherein, the dotted line represents a bonding, Y1 represents an organic group with a valency of k+1, Rs represents a group containing at least one silicon atom, "k" represents 1, 2 or 3, and "n" represents 0 or 1. There can be provided a tetracarboxylic acid diester compound which can lead a polymer of a polyimide precursor capable of using a base resin of a negative photosensitive resin composition which is capable of forming a fine pattern and giving high resolution, a polymer of a polyimide precursor obtained by using the tetracarboxylic acid diester compound and a method for producing the same.