Polyimide Resin Precursor Composition for Low-Temperature Semiconductor Films

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Polyimide resins used in the semiconductor field require higher adhesion to substrates like silicon and silicon oxide, better solubility in rinse solutions, and lower temperature curing due to high-temperature device configurations, which existing polyimide resins do not adequately address.

Innovation Solution

A polyimide resin precursor containing specific structural units derived from tetracarboxylic dianhydride and diamine compounds, such as 3,3',4,4'-diphenylsulfonetetracarboxylic dianhydride and 4-aminophenyl-4-aminobenzoate, which enhance thermal resistance, adhesion, and solubility in organic solvents.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If conventional polyimide resin is used, then thermal resistance is achieved, but adhesion to silicon-based substrates is insufficient

Engineering Contradiction:

Improveadhesion to substrateVSAvoidthermal resistance

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The patent modifies the chemical structure of polyimide resin by incorporating specific structural units (A1) derived from compounds with Formula (a1) and (A4) derived from compounds with Formula (a4), which changes the molecular parameters to enhance both adhesion to silicon-based substrates and thermal resistance simultaneously

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite polyimide resin structure combining multiple structural units (A1, A3, A4) with structural units B1-B6 in specific proportions, where the composite structure achieves synergistic effects for improved adhesion and thermal resistance

Inventive Principle:

Principle #40Composite materials

2Stability of the object's composition

If conventional polyimide resin is used, then thermal resistance is maintained, but solubility in rinse solutions is poor

Engineering Contradiction:

Improvethermal resistanceVSAvoidsolubility in rinse solution

Core Design Contradiction:

Stability of the object's compositionVSEase of manufacture

Solution Approach 1:

The patent introduces structural units with specific chemical compositions (A1 from Formula (a1) compounds and A4 from Formula (a4) compounds) that modify the resin's solubility parameters while preserving thermal resistance through controlled molecular architecture

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent creates local regions within the polyimide resin structure containing specific structural units that enhance solubility in rinse solutions, while other regions maintain the thermal resistance properties through the overall composite structure

Inventive Principle:

Principle #3Local quality

3Strength

If high-temperature curing is applied, then adhesion is improved, but device damage occurs due to high-temperature sensitivity

Engineering Contradiction:

ImproveadhesionVSAvoidtemperature sensitivity

Core Design Contradiction:

StrengthVSObject-affected harmful factors

Solution Approach 1:

The patent modifies the curing characteristics by incorporating structural units that enable adhesion enhancement at lower temperatures, changing the thermal curing parameters from high-temperature processes to low-temperature processes suitable for temperature-sensitive devices

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentEP4696736A1Polyimide resin precursor, polyimide resin, and polyimide film

Publication Date: 2026.02.18 MITSUBISHI GAS CHEM CO INC

AI summary

Disclosed is a polyimide resin precursor containing: a structural unit A derived from a tetracarboxylic dianhydride; and a structural unit B derived from a diamine, in which the structural unit A includes a structural unit (A1) derived from a compound represented by Formula (a1) described below, and the structural unit B includes at least one selected from the group consisting of a structural unit (B1) derived from a compound represented by Formula (b1) described below, a structural unit (B2) derived from a compound represented by Formula (b2) described below, and a structural unit (B3) derived from a compound represented by Formula (b3) described below.