Polyimide Precursor Solution Narrow Particle Size Distribution
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Solution Overview
Problem
Porous polyimide films formed from polyimide precursor solutions with aggregated resin particles often exhibit pinholes due to low dispersibility, leading to mechanical weaknesses and manufacturing inefficiencies.
Innovation Solution
A polyimide precursor solution with resin particles having a volume particle size distribution where one peak accounts for 90% to 100% of the total volume frequency, ensuring good dispersibility and reduced aggregation, which is achieved by using resin particles with surface acidic groups and an organic amine compound in an aqueous solvent system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If resin particles are used in polyimide precursor solution, then porous polyimide films can be formed, but the resin particles aggregate and exhibit low dispersibility causing pinholes
Solution Approach 1:
The patent controls the volume particle size distribution parameters of resin particles, specifically setting the span value to 0.5 or less and ensuring one peak accounts for 90-100% of total volume frequency. This parameter optimization prevents aggregation while maintaining porous structure formation capability.
Solution Approach 2:
The patent uses a specific solvent system (N-methyl-2-pyrrolidone as main solvent with N,N-dimethylacetamide as co-solvent) as an intermediary medium to improve resin particle dispersibility and prevent aggregation during the film formation process.
2Ease of manufacture
If resin particles aggregate in polyimide precursor solution, then manufacturing process can be simplified, but pinholes are formed reducing mechanical strength
Solution Approach 1:
The patent optimizes particle size distribution parameters (span ≤ 0.5, one peak at 90-100% volume frequency) to prevent aggregation, thereby maintaining mechanical strength while keeping the manufacturing process simple through direct casting without additional dispersing steps.
3Adaptability or versatility
If resin particles with broad size distribution are used, then manufacturing flexibility is improved, but dispersibility decreases and pinholes increase
Solution Approach 1:
The patent specifies narrow size distribution parameters (span ≤ 0.5) for resin particles to ensure high dispersibility and eliminate pinholes, while maintaining manufacturing flexibility through controlled particle synthesis and selection processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in porous polyimide films with reduced pinholes, improved mechanical properties, and simplified manufacturing processes, as well as reduced residual stress and variation in pore distribution, enhancing the films' reliability and productivity.
Implementation Method 1
resin particles with surface acidic groups and an organic amine compound in an aqueous solvent system
Data Source
AI summary
A polyimide precursor solution contains resin particles and a polyimide precursor. The resin particles in the polyimide precursor solution have a volume particle size distribution with one or more peaks. The volume frequency of a peak having the highest volume frequency of the one or more peaks accounts for 90% to 100% of the total volume frequency of all peaks of the volume particle size distribution.