Polyimide-PTFE Supported Copper Foil Handling
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Solution Overview
Problem
Thin and ultrathin copper foils are fragile, leading to handling defects like bending and creasing, which result in imperfections in end products, and the use of copper carriers to address this issue increases costs and slows down the manufacturing process due to their thickness and the need for slow plating processes.
Innovation Solution
A supported copper foil system comprising a poly-based film with polyimide and polytetrafluoroethylene, an adhesive between the film and the copper foil, and a low-tack adhesive that allows easy removal of the film, providing rigidity and protection while being heat-resistant, and a manufacturing method involving thermal treatment and attachment using static heating elements and rollers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper carriers are used to support thin copper foils, then handling defects such as bending are prevented, but manufacturing cost increases and manufacturing speed decreases
Solution Approach 1:
The patent replaces expensive, thick copper carriers with inexpensive, thin paper or plastic carriers that are discarded after use. These disposable carriers provide sufficient support during handling and manufacturing processes without the cost and speed penalties of copper carriers, then are removed and discarded rather than reused.
Solution Approach 2:
The patent uses thin film carriers (paper or plastic) instead of thick copper carriers. These thin film carriers are sufficiently flexible to conform to the copper foil and provide support during handling, yet thin enough to allow fast manufacturing processes and easy removal without slowing production.
2Reliability
If copper carriers are used to support thin copper foils, then handling defects such as bending are prevented, but manufacturing cost increases
Solution Approach 1:
The patent replaces expensive copper carriers with inexpensive disposable carriers made from paper or plastic. These carriers cost a fraction of copper carriers while providing the necessary support function during manufacturing, directly reducing material costs.
Solution Approach 2:
The patent uses thin film carriers (paper or plastic) instead of thick copper carriers. These thin film carriers are sufficiently flexible to conform to the copper foil and provide support during handling, yet thin enough to allow fast manufacturing processes and easy removal without slowing production.
3Ease of manufacture
If thin copper foils are handled without support, then manufacturing cost decreases, but handling defects such as bending and creasing occur
Solution Approach 1:
The patent introduces thin film carriers (paper or plastic) as intermediary support structures between the copper foil and handling equipment. These carriers act as mediators that protect the fragile copper foil from bending and creasing during handling and manufacturing processes while being inexpensive enough to justify their use.
Solution Approach 2:
The patent uses thin film carriers (paper or plastic) instead of thick copper carriers. These thin film carriers are sufficiently flexible to conform to the copper foil and provide support during handling, yet thin enough to allow fast manufacturing processes and easy removal without slowing production.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a cost-effective and efficient method to handle thin copper foils by adding rigidity and protection without transferring adhesive to the foil, enabling high-temperature applications and reducing manufacturing time by allowing faster processing without the need for thick copper carriers.
Implementation Method 1
an adhesive provided between the poly-based film and the thin copper foil, the adhesive removably coupling the poly-based film to the copper foil
Implementation Method 2
manufacturing method involving thermal treatment and attachment using static heating elements and rollers
Data Source
AI summary
A supported copper foil is disclosed, comprising: a poly-based film that contains polyimide and polytetrafluoroethylene; a thin copper foil; and an adhesive provided between the poly-based film and the thin copper foil, the adhesive removably coupling the poly-based film to the copper foil.