Polyimide Encapsulating Material for High-Insulation PV Modules
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Solution Overview
Problem
Existing photovoltaic module encapsulating materials, such as POE and EVA, have limitations including long curing time, low capacity utilization, and poor insulation performance, leading to increased material consumption and weight due to the need for a significant electrical safety distance between charged bodies and metal frames.
Innovation Solution
A composite encapsulating material incorporating high insulation polyimide, modified polyimide, and auxiliary agents like polybutylene terephthalate, which provides improved bulk resistivity and breakdown voltage strength, reducing the electrical safety distance and enhancing material utilization and weight reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional encapsulating materials (EVA, POE) are used, then the module can be manufactured with existing processes, but the insulation performance is poor requiring larger electrical safety distances which increases material consumption and weight
Solution Approach 1:
The patent uses a composite encapsulating material consisting of polyimide base resin combined with specific modifiers (polyperfluoroethylene propylene, tetramethyldisiloxane, fluorine-containing linear polyimide) to achieve high insulation performance while reducing material consumption. This composite approach allows optimization of both electrical properties and mechanical properties simultaneously.
Solution Approach 2:
The patent changes the chemical composition parameters of the encapsulating material by incorporating specific ratios of modifiers (1-10 parts polyperfluoroethylene propylene, 2-10 parts tetramethyldisiloxane, 2-10 parts fluorine-containing linear polyimide per 100 parts polyimide) to achieve bulk resistivity of 1×10^17 Ω·cm and breakdown voltage of 80 KV/mm, thereby reducing the required electrical safety distance.
2Productivity
If conventional encapsulating materials are used, then the manufacturing process is simple, but the curing time is long and lamination cycle is extended which reduces productivity
Solution Approach 1:
The patent modifies the chemical structure and composition of the encapsulating material by adding specific catalysts and modifiers that accelerate the curing reaction. The fluorine-containing linear polyimide and other modifiers facilitate faster crosslinking and curing, reducing both curing time and lamination cycle time while maintaining material performance.
3Reliability
If larger electrical safety distance is maintained to ensure insulation, then safety is improved, but the blank area at module edge increases reducing material utilization rate
Solution Approach 1:
The patent achieves superior insulation performance through optimized chemical composition (polyimide with 1-10 parts polyperfluoroethylene propylene, 2-10 parts tetramethyldisiloxane, and 2-10 parts fluorine-containing linear polyimide), enabling reduction of the electrical safety distance from conventional values to just 5-10mm while maintaining bulk resistivity of 1×10^17 Ω·cm and breakdown voltage of 80 KV/mm, thereby improving material utilization rate.
4Reliability
If conventional encapsulating materials are used, then the module weight is reduced, but the insulation performance is insufficient requiring larger safety margins
Solution Approach 1:
The patent develops a composite encapsulating material system where polyimide is combined with lightweight modifiers (polyperfluoroethylene propylene, tetramethyldisiloxane, fluorine-containing linear polyimide) in optimized ratios. This composite achieves high insulation performance (bulk resistivity 1×10^17 Ω·cm, breakdown voltage 80 KV/mm) with lower density than conventional materials, reducing module weight while eliminating the need for larger safety margins.
Data Source
AI summary
Provided is a composite encapsulating material and a photovoltaic module encapsulated with the composite encapsulating material, which relate to the technical field of photovoltaic modules. At least a partial area of the composite encapsulating material includes a high insulation material, and the high insulation material includes polyimide, modifier and modified polyimide. The above technical solution can improve an insulation performance of the encapsulating material, reduce a blank area of an edge of the module, reduce a weight of the photovoltaic module, and further reduce comprehensive cost of the photovoltaic module.