Polyimide Polymer Reactive End Group for Mechanical Strength
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional polyimide precursor-based positive photosensitive resin compositions for semiconductor and display devices are limited by the use of alkaline aqueous solutions in the development step, which restricts the molecular weight of the polymer and subsequently limits the mechanical properties that can be achieved.
Innovation Solution
Introducing a reactive monomer with a reactive end group, represented by Formula Q, to the terminal of a polymer formed from a polyimide precursor, which enhances the physical properties and allows for the development of a negative-type photosensitive resin composition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If alkaline aqueous solution is used for development, then the photoresist film can be developed effectively, but the molecular weight of the polymer resin is limited which restricts mechanical properties
Solution Approach 1:
The invention changes the chemical composition parameters of the polymer resin by incorporating specific imide rings with fluorinated groups and controlling the molecular weight to exceed 30,000. This parameter change enables the resin to withstand alkaline aqueous development while achieving superior mechanical properties including tensile strength of 0.5-5.0 g/denier and elongation of 20-100%, resolving the contradiction between ease of manufacture and strength.
2Strength
If polymer resin with high molecular weight is used, then mechanical properties are improved, but the use of alkaline aqueous solution in development limits the achievable molecular weight
Solution Approach 1:
The invention creates a composite polymer resin system combining polyimide backbone structures with specific imide ring substitutions (Formula 1) and terminal functional groups (Formula 2). This composite structure achieves molecular weight >30,000 while maintaining compatibility with alkaline aqueous development, enabling both high mechanical properties and ease of manufacture through synergistic material design.
3Ease of operation
If conventional polyimide precursor is used, then the resin can be processed, but the mechanical properties are limited due to molecular weight restrictions
Solution Approach 1:
The invention modifies the conventional polyimide precursor by incorporating fluorinated imide rings (Formula 1) and specific terminal groups (Formula 2), changing the chemical parameters to achieve molecular weight >30,000. This enables both excellent processability during coating and baking steps and superior mechanical properties with tensile strength up to 5.0 g/denier, resolving the contradiction between ease of operation and strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The introduction of the reactive monomer improves the tensile strength and elongation of the polymer composition, enabling the production of semiconductor and display devices with enhanced mechanical properties.
Implementation Method 1
a photoinitiator, which absorbs light during the exposure step and generates radicals
Data Source
AI summary
Provided are a polyimide precursor comprising a reactive end group of Formula Q, a polyimide composition comprising the same and having improved tensile strength and elongation, and a pattern or film or a semiconductor or display device or an electronic device prepared using the same.