Polyimide Resin Adhesive for High-Temperature Electronics
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Solution Overview
Problem
Conventional adhesives used in electronic device production, such as acrylic and silicone resins, suffer from inadequate heat resistance and volatile component generation at high temperatures, while polysiloxane-based polyimide resins lack sufficient adhesive strength and uniformity over large areas.
Innovation Solution
A polyimide resin composition incorporating a polysiloxane diamine residue in at least 60% by mole, along with an acid anhydride residue, provides excellent heat resistance and adhesiveness without volatile component generation, enabling uniform adhesion over large areas at room temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If acrylic resins are used as adhesives, then transparency and ease of operation are improved, but heat resistance deteriorates due to decomposition and volatile component generation at 200°C or higher
Solution Approach 1:
The invention changes the chemical composition parameters by using polyimide resin instead of acrylic resin, and further optimizes the diamine residue composition to achieve both high transparency and heat resistance. The specific parameter change involves controlling the mole ratio of polysiloxane diamine residue to total diamine residue at 60% or more, which resolves the contradiction between transparency and heat resistance.
Solution Approach 2:
The invention creates a composite adhesive material by combining polyimide resin with specific ratios of polysiloxane diamine residues and other diamine residues. This composite structure integrates the heat resistance of polyimide with the adhesive properties enhanced by polysiloxane diamine, while maintaining transparency. The composite material approach allows simultaneous achievement of multiple contradictory properties.
2Reliability
If silicone resins are used as adhesives, then heat resistance is improved with wide service temperature range, but volatile component generation occurs at 250°C or higher and low-molecular-weight silicone components adversely affect electronic parts
Solution Approach 1:
The invention changes the chemical composition by selecting polyimide resin as the base material and specifically controlling the diamine component composition. By setting the polysiloxane diamine residue content at 60% or more of total diamine residue, the invention achieves heat resistance comparable to silicone resins while eliminating the harmful volatile component generation issue that plagues conventional silicone adhesives at high temperatures.
Solution Approach 2:
The invention replaces the problematic silicone resin material with polyimide resin-based adhesive composition. This substitution eliminates the short-living (temporary) stability of silicone resins that leads to decomposition and volatile generation at high temperatures, while maintaining the desired heat resistance performance through the specific polyimide composition design.
3Ease of operation
If polysiloxane-based polyimide resins with high-molecular-weight polysiloxane diamine are used, then press-bonding property at room temperature is improved, but adhesive strength and uniform adhesion over large area are insufficient
Solution Approach 1:
The invention optimizes the molecular weight parameter of polysiloxane diamine to a specific range (45 to 200 for average n value) and controls the composition ratio of polysiloxane diamine residue to other diamine residues at 60% or more. This parameter optimization simultaneously achieves good press-bonding property at room temperature and high adhesive strength, resolving the contradiction between ease of operation and strength.
Solution Approach 2:
The invention uses a partial composition approach by incorporating polysiloxane diamine residues at 60% or more of total diamine residues, but not 100%. This partial composition allows the adhesive to benefit from the press-bonding properties of polysiloxane while maintaining the adhesive strength provided by the balanced composition with other diamine components, achieving both desirable properties without excessive reliance on a single component.
Data Source
AI summary
A polyimide resin includes an acid anhydride residue; and a diamine residue, the polyimide resin including a residue of a polysiloxane diamine represented by Formula (1) in an amount of not less than 60% by mole in the total amount of the diamine residue:wherein, n is a natural number and an average value thereof calculated from the average molecular weight of the polysiloxane diamine is 45 to 200; R1 and R2, the same or different, each represent an alkylene group having 1 to 30 carbon atoms or a phenylene group; and R3 to R6, the same of different, each represent an alkyl group having 1 to 30 carbon atoms, a phenyl group or a phenoxy group.