Polyimide Resin with Carboxyl Side Chains for High-Resolution Patterns
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Solution Overview
Problem
Current photosensitive resin compositions for high-density semiconductor packaging face challenges in achieving high resolution and fine pattern formation due to poor solubility in aqueous alkaline solutions, mechanical strength, and adhesiveness, particularly at low temperatures, which limits their application in miniaturized electronic devices.
Innovation Solution
A tetracarboxylic dianhydride-based polyimide resin with specific structural units, capable of forming high-resolution patterns and exhibiting excellent mechanical and adhesive properties, is developed. This resin is soluble in aqueous alkaline solutions, allowing for improved pattern formation and integration in electronic devices, and is used in both positive and negative type photosensitive resin compositions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional polyimide-based materials are used for photosensitive insulating materials, then mechanical strength and adhesiveness are maintained, but solubility in aqueous alkaline solutions is poor, limiting resolution performance in pattern formation
Solution Approach 1:
The invention modifies the chemical structure of polyimide by introducing specific side chains with carboxyl groups that enhance solubility in aqueous alkaline solutions, thereby improving resolution performance while maintaining mechanical properties
Solution Approach 2:
The invention creates a composite polyimide structure combining rigid backbone segments for mechanical strength with soluble side chain segments, achieving both high resolution performance and adequate solubility in developing solutions
2Temperature
If low-temperature curable resin compositions are used, then thermal load on devices is reduced, but mechanical strength and stretchability are insufficient
Solution Approach 1:
The invention designs polyimide molecules with low glass transition temperature through specific side chain configurations, enabling low-temperature curing while maintaining adequate mechanical strength for semiconductor packaging applications
3Volume of moving object
If ultrathin films are used for pattern formation, then high-density packaging is achieved, but resolution performance deteriorates due to poor solubility
Solution Approach 1:
The invention enhances the solubility parameter of polyimide by incorporating hydrophilic side chains, enabling ultrathin films to be properly dissolved and developed in aqueous alkaline solutions, thus achieving both thinness and high resolution
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The polyimide resin enables the formation of fine patterns with enhanced mechanical strength, adhesiveness, and heat resistance, addressing the limitations of existing compositions by providing high-resolution patterns and reliable protective films for electronic parts.
Implementation Method 1
This resin is soluble in aqueous alkaline solutions, allowing for improved pattern formation and integration in electronic devices
Implementation Method 2
a polyimide-based material or polybenzoxazole-based material curable at a low temperature of 250° C. or less, further preferably 200° C. or less
Data Source
AI summary
An object of the present invention is to provide: a tetracarboxylic dianhydride which can lead to a polyimide usable as a base resin of a photosensitive resin composition capable of forming a fine pattern and obtaining high resolution without impairing excellent characteristics such as mechanical strength and adhesiveness; a polyimide resin obtained by using the tetracarboxylic dianhydride; and a method for producing the polyimide resin. The tetracarboxylic dianhydride is shown by the following general formula (1).