Photosensitive Polyimide Resin for Copper Void and Migration Suppression
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Solution Overview
Problem
Conventional polyimide films used in semiconductor devices suffer from copper voids and copper migration at the interface with copper layers under high-temperature and high-humidity conditions, leading to potential short circuits and reduced adhesion, which is a challenge in high-reliability tests.
Innovation Solution
A photosensitive resin composition is developed by incorporating a tetrazole derivative with specific pKa and polar surface area, along with a polyimide precursor, photopolymerization initiator, and solvent, to enhance copper adhesion and suppress copper voids and migration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional polyimide films are used in semiconductor devices, then the devices can operate under normal conditions, but copper voids and copper migration occur at the interface with copper layers under high-temperature and high-humidity conditions, leading to potential short circuits and reduced adhesion
Solution Approach 1:
The patent introduces a specific additive composition containing a carboxylic acid compound and a hydroxyl group-containing compound as an intermediary layer between the copper layer and the polyimide resin. This intermediary composition forms a protective interface that prevents direct harmful interaction between copper and the resin under high-temperature and high-humidity conditions, thereby suppressing copper voids and copper migration while maintaining strong adhesion.
Solution Approach 2:
The patent creates a composite resin system by combining polyimide resin with specific additives including carboxylic acid compounds and hydroxyl group-containing compounds. This composite material structure provides both the heat resistance of polyimide and the copper-stabilizing properties of the additives, achieving high reliability by preventing copper degradation and maintaining adhesion under harsh conditions.
2Adaptability or versatility
If the resin layer is placed in contact with copper layer in large-area packaging structures, then the structure enables higher density mounting, but the difference in thermal expansion coefficient causes stress leading to peeling between copper and interlayer insulating material
Solution Approach 1:
The patent modifies the chemical composition parameters of the resin layer by incorporating specific carboxylic acid compounds and hydroxyl group-containing compounds. These compositional changes alter the thermal and mechanical properties of the resin, enabling it to better match the thermal expansion coefficient of copper and reduce stress-induced peeling while maintaining adhesion strength in large-area packaging structures.
3Productivity
If copper wiring is used in semiconductor devices with fine wiring, then high integration is achieved, but copper migration into the resin layer causes short circuits between wirings
Solution Approach 1:
The patent employs carboxylic acid compounds and hydroxyl group-containing compounds as intermediary substances that form a protective barrier at the copper-resin interface. This intermediary layer effectively blocks copper migration into the resin while maintaining the fine wiring structure, thereby preventing short circuits and ensuring electrical insulation in high-density integrated circuits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively prevents copper voids and migration, ensuring high adhesion and reducing the likelihood of short circuits in semiconductor devices, particularly in high-temperature and high-humidity environments.
Implementation Method 1
a photopolymerization initiator
Data Source
AI summary
The present disclosure provides a photosensitive resin composition which achieves high copper adhesion, while suppressing the occurrence of a copper void at the interface between a copper layer and a resin layer after a high temperature storage test and having little copper migration in a b-HAST test. A photosensitive resin composition according to the present disclosure contains the following components: (A) a polyimide precursor and/or a polyimide resin; (B) a tetrazole derivative; (C) a photopolymerization initiator; and (D) a solvent. The tetrazole derivative (B) has a pKa of 1.3 to 4.1, or is represented by general formula (1) or (2), or has a polar surface area (tPSA) of 81 to 200.