Polyimide Resin Composition for Thermal Cycle Crack Resistance
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Solution Overview
Problem
Existing resin compositions for semiconductor devices lack excellent thermal cycle test (TCT) crack resistance, which is crucial for withstanding severe temperature fluctuations without cracking between the cured substance and the base material.
Innovation Solution
A resin composition containing a polyimide or polyimide precursor, which, when cured, meets specific conditions: a Young's modulus of 3.5 GPa or more, a coefficient of thermal expansion less than 50 ppm/°C, a glass transition temperature of 240°C or higher, and a breaking elongation of 40% or more.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a resin composition is used for semiconductor devices, then manufacturing adaptability and performance are improved, but TCT crack resistance is insufficient
Solution Approach 1:
The patent applies parameter changes by precisely controlling the glass transition temperature (Tg) of the cured substance to be 240°C or higher, and specifying the Young's modulus to be within 3.5-6.5 GPa. These parameter optimizations resolve the contradiction by ensuring crack resistance under thermal cycling while maintaining manufacturing adaptability through controlled material properties.
Solution Approach 2:
The patent uses composite materials by formulating a resin composition containing a polyimide precursor with specific structural characteristics (aromatic rings, heteroatoms) combined with controlled molecular weight and functional groups. This composite approach achieves both excellent TCT crack resistance and manufacturing adaptability by balancing structural rigidity with processability.
2Strength
If the Young's modulus is increased to improve crack resistance, then strength is improved, but breaking elongation may decrease
Solution Approach 1:
The patent applies parameter changes by defining a specific range for Young's modulus (3.5-6.5 GPa) and glass transition temperature (240°C or higher). This controlled parameter optimization ensures that the material achieves sufficient strength for crack resistance while maintaining adequate breaking elongation through the balanced molecular structure of the polyimide precursor.
Solution Approach 2:
The patent applies local quality by incorporating specific functional groups and structural units (aromatic rings, heteroatoms) at specific positions within the polyimide precursor molecule. This localized structural optimization allows different regions of the material to contribute differently to strength and elongation properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves excellent TCT crack resistance, ensuring that the cured substance remains intact even after 1,000 cycles of temperature variation from -55°C to 200°C, thereby enhancing the reliability of semiconductor devices.
Implementation Method 1
The polyimide precursor is cyclized by, for example, heating, and it becomes a polyimide during curing.
Implementation Method 2
a coefficient of thermal expansion of the cured substance in a temperature range of 25° C. to 125° C. is less than 50 ppm/° C.
Data Source
AI summary
There is provided a resin composition containing a polyimide or a polyimide precursor, where a cured substance obtained from the resin composition satisfies all of the following conditions (i) to (iv), and are provided a cured substance, a laminate, a manufacturing method for a cured substance, a manufacturing method for a laminate, a manufacturing method for a semiconductor device, and a semiconductor device; condition (i): a Young's modulus of the cured substance is 3.5 GPa or more, condition (ii): a coefficient of thermal expansion of the cured substance in a temperature range of 25° C. to 125° C. is less than 50 ppm/° C., condition (iii): a Tg of the cured substance is 240° C. or higher, and condition (iv): a breaking elongation of the cured substance is 40% or more.