Negative Photosensitive Polyimide Resin for Low-Temperature Fine Patterning
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Solution Overview
Problem
Existing photosensitive resin compositions using polyimide precursors face challenges with high-temperature imidization, storage stability issues, and the inability to form fine patterns with high aspect ratios, leading to thermal deformation and reduced chemical resistance.
Innovation Solution
A negative photosensitive resin composition incorporating a polymer compound with a polyimide precursor structure, a nitrogen-containing organic compound, and a solvent, which enables imide ring closure at low temperatures (200°C or lower) and includes a photoinitiator, crosslinking agents, and antioxidants to enhance stability and chemical resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If imidization treatment is performed at high temperature exceeding 300°C, then desired polyimide film is obtained, but limitation to underlayer base material, oxidation of copper wiring, and thermal damage to electronic components occur
Solution Approach 1:
The patent changes the temperature parameter from conventional high temperature (300°C or higher) to low temperature (200°C or lower) by introducing a thermal base generator that produces amine compounds in situ, enabling imide ring closure reaction at reduced temperatures while maintaining polyimide film quality
Solution Approach 2:
The patent introduces a thermal base generator as an intermediary substance that decomposes to generate amine compounds, which act as catalysts for the imide ring closure reaction, thereby mediating the imidization process at lower temperatures without direct thermal exposure
2Manufacturing precision
If conventional photosensitive resin composition is used, then pattern formation is achieved, but fine patterns with high aspect ratio cannot be formed due to thermal flow in curing reaction
Solution Approach 1:
The patent changes the curing temperature parameter to 200°C or lower using a thermal base generator, which suppresses thermal flow and enables formation of fine patterns with high aspect ratios without deformation
Solution Approach 2:
The patent replaces conventional high-temperature thermal curing with low-temperature chemical curing through amine-catalyzed imide ring closure, eliminating the mechanical thermal flow that causes pattern deformation
3Stability of the object's composition
If polyimide precursor composition is stored, then cyclization reaction proceeds during storage, resulting in gelation
Solution Approach 1:
The patent introduces a thermal base generator as an intermediary that remains stable during storage and only activates upon heating, generating amine compounds at the appropriate time to catalyze imide ring closure without causing premature gelation
Solution Approach 2:
The patent incorporates all necessary components (polyimide precursor, thermal base generator, photoinitiator) in advance in a stable formulation that prevents premature reaction, with the imidization catalyst generated in situ only when heating is applied
4Reliability
If imidazoles are added as imidization catalyst, then imide ring closure reaction is facilitated, but glass transition temperature is reduced and pattern deformation occurs
Solution Approach 1:
The patent uses a thermal base generator that produces amine compounds as intermediaries to catalyze imide ring closure, replacing direct addition of imidazoles and avoiding the side effects of glass transition temperature reduction and pattern deformation
Solution Approach 2:
The patent changes the catalyst system from imidazoles to in-situ generated amine compounds through thermal decomposition, achieving effective imidization while maintaining glass transition temperature and preventing pattern deformation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition allows for the formation of fine patterns with high aspect ratios and provides cured films with excellent chemical resistance and high glass transition temperature, maintaining stability during storage and preventing thermal deformation.
Implementation Method 1
a photoinitiator
Implementation Method 2
a thermal base generator that generates a base by heat
Data Source
AI summary
The present invention is a negative photosensitive resin composition includes: (A) a polymer compound having a polyimide precursor structure; (C) a photoinitiator; (D) a nitrogen-containing organic compound represented by the following general formula (1); and (E) a solvent. This can provide: a photosensitive resin composition using a polyimide precursor, which enables imide ring closure reaction to be performed at low temperature, has excellent stability of the composition, and is capable of forming a fine pattern and providing resistance to chemicals. Additionally, a patterning process using the photosensitive resin composition, an interlayer insulating film characterized by including a cured film of a photosensitive resin composition, and an electronic component are to be provided.