Thermosetting Polyimide Resin for High-Frequency Substrates
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Solution Overview
Problem
Existing polyimide and bismaleimide resins face challenges with low glass transition temperature (Tg), high water absorption, and high dielectric properties, limiting their application in high-frequency substrates and 5G communication materials.
Innovation Solution
Introduction of fluorene-containing segments and allylsuccinic anhydride, along with a washing process to remove residual acids and polar solvents, enhances solvent solubility and cross-linking, resulting in a thermosetting polyimide resin with improved Tg and reduced dielectric properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional polyimide is used as insulation material, then it provides basic electrical insulation, but it exhibits high water absorption, higher dielectric constant (Dk) and dielectric loss (Df), and poor processability
Solution Approach 1:
The patent modifies the chemical structure of polyimide by introducing fluorene units and long-chain alkyl groups (C36 dimer diamine), changing the molecular parameters to achieve lower polarity, reduced water absorption, and improved dielectric properties while maintaining electrical insulation performance
Solution Approach 2:
The invention creates a composite molecular structure combining fluorene rigid units with long flexible alkyl chains, achieving a balance between structural stability for insulation and flexible low-polarity characteristics for reduced water absorption and improved dielectric performance
2Reliability
If polyimide resin is used for high-frequency substrate, then it provides electrical insulation, but the signal transmission loss increases due to high Dk and Df values
Solution Approach 1:
The patent changes the molecular parameters by incorporating fluorene units and long C36 alkyl chains, which reduce the polarity and dielectric loss factor (Df) of the polyimide, thereby minimizing signal transmission loss and improving high-frequency signal integrity
3Ease of manufacture
If conventional polyimide synthesis method is used, then it produces polyimide resin, but it results in low glass transition temperature (Tg) and poor thermal performance
Solution Approach 1:
The patent modifies the molecular structure parameters by introducing rigid fluorene units into the polyimide backbone, which significantly increases the glass transition temperature (Tg) and thermal stability while maintaining ease of manufacture through conventional synthesis methods
4Reliability
If polyimide is used for 5G communication substrate, then it provides electrical insulation, but the processability is poor due to high viscosity and solvent resistance issues
Solution Approach 1:
The patent changes the molecular parameters by incorporating long C36 alkyl chains that provide appropriate viscosity and solubility characteristics, enabling good processability for 5G substrate manufacturing while maintaining electrical insulation performance through the fluorene units
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a Tg above 200°C, low dielectric constant, and low water absorption, making the thermosetting polyimide resin suitable for next-generation high-speed and high-frequency substrates and semiconductor packaging materials.
Implementation Method 1
A dehydration reaction is performed on C36 dimer diamine and fluorene dianhydride to synthesize an amine-terminated polyimide resin. Allylsuccinic anhydride is added to perform a dehydration reaction to obtain an allyl-terminated polyimide resin. The resin is then cured with a maleimide compound to achieve cross-linking.
Implementation Method 2
The patent employs a washing process to remove residual acids and polar solvents from the synthesized polyimide resin, thereby reducing water absorption and improving dielectric properties for high-frequency applications.
Data Source
AI summary
The disclosure provides a thermosetting polyimide resin and a manufacturing method thereof, a composition, a prepolymer, a film, an adhesive, and a use thereof. The composition includes at least: (a) a maleimide compound and (b) the thermosetting polyimide resin. The disclosure provides the thermosetting polyimide resin and the prepolymer, for manufacturing a film, an adhesive sheet, a cover film, a redistribution layer, a build-up board, a prepreg sheet, a high-frequency substrate, an integrated circuits carrier board, an adhesive for copper foil, a semiconductor packaging material, a radome, a substrate for server, a substrate for base station, a substrate for vehicle, etc.