Polyimide Resin for High-Temperature Capacitors
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Solution Overview
Problem
Current polyimide resins used in high-temperature and dielectric applications, such as thin film capacitors, face limitations due to low glass transition temperatures and dielectric constants, which restrict their continuous-use working temperatures and stored energy capacity.
Innovation Solution
Development of a polyimide resin with enhanced glass transition temperatures above 150°C and increased dielectric constants up to 4.4, achieved through specific chemical formulations and reactions involving residues with functional groups like CN, F, and SO2, combined with inorganic fillers, to create a suitable material for high-performance capacitors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional polyimide resins (polyetherimides, polypropylene, polycarbonate, polyesters) are used, then manufacturing simplicity and cost-effectiveness are maintained, but glass transition temperature and dielectric constant are limited, restricting continuous-use temperature to about 120°C or less and stored energy to about 1 Joule/cc
Solution Approach 1:
The patent modifies the chemical structure of polyimide resins by incorporating specific functional groups (cyano, fluorine, sulfonyl, sulfone, carbonyl, carboxyl, ester, amide, imide, isocyanate, urea, thiocyanate, phosphate, borate, silane, titanate) into the polymer backbone. These parameter changes at the molecular level directly increase the glass transition temperature above 150°C and enhance dielectric constant, thereby improving continuous-use working temperature and thermal stability simultaneously
Solution Approach 2:
The patent creates composite polyimide resins by combining multiple functional groups and incorporating inorganic fillers into the polymer matrix. This composite approach allows the material to achieve both high thermal stability (Tg > 150°C) and high dielectric constant (up to 4.4), resolving the contradiction between temperature capability and reliability
2Quantity of substance
If conventional polyimide resins with low dielectric constants are used, then material simplicity is maintained, but stored energy capacity is limited to about 1 Joule/cc
Solution Approach 1:
The patent systematically varies the chemical parameters of the polyimide resin by introducing high-dielectric-constant functional groups (particularly cyano, fluorine, and sulfonyl groups) into the polymer structure. These parameter changes increase the dielectric constant from conventional values to up to 4.4, thereby increasing stored energy capacity to exceed 1 Joule/cc while managing formulation complexity through structured chemical design
3Temperature
If polyimides with higher glass transition temperatures are developed, then thermal stability is improved, but material complexity and manufacturing difficulty increase
Solution Approach 1:
The patent achieves high glass transition temperatures (above 150°C) by modifying the chemical parameters of the polyimide resin through the incorporation of rigid aromatic structures and specific functional groups. The manufacturing process maintains feasibility by using conventional polyimide synthesis routes with modified monomers, thus achieving high Tg without excessive manufacturing complexity
Solution Approach 2:
The patent develops composite polyimide materials that combine high-Tg polymer matrices with inorganic fillers. This composite approach enhances glass transition temperature and thermal stability while the fillers can also improve processability, thereby managing manufacturing difficulty alongside achieving high temperature performance
Data Source
AI summary
A polyimide resin is provided. The polyimide resin comprises the reaction product of a polyimide resin and an amine comprising a C1-10 hydrocarbon substituted with CN, F, SO2, SO, S, SO3, SO3−, PO, PO2H, PO3H, PO2−, PO3−2, CO, CO2−, CO2H, CONH, CONH2, NHCOHN, OCONH, OCO2, N, NH, NH2, NO2, CSNH, CSNH2, NHCSNH, OTi(OR4)3, or OSi(OR4)3 or combinations of these, wherein R4 is a C1-10 aliphatic or aromatic hydrocarbon. The resin may be used to provide a thin film that in turn, may advantageously be used to form, wholly or in part, articles such as capacitors, sensors, batteries, flexible printed circuit boards, keyboard membranes, motor/transformer insulations, cable wrappings, industrial tapes, interior coverage materials, and the like. In particular, a capacitor comprising the thin film and methods of making the same are also provided.