Polyimide Resin Composition for Low Dielectric Semiconductor Devices
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Solution Overview
Problem
Existing resin compositions used in semiconductor devices have high dielectric constants, leading to significant transmission loss, which hinders their performance.
Innovation Solution
A resin composition comprising polyimide or its precursor with a ring structure in the side chain, a polymerization initiator, and a polymerizable compound, designed to reduce the dielectric constant through reduced polarizability and polar group content.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional resin compositions are used in semiconductor devices, then manufacturing adaptability and insulating properties are maintained, but dielectric constant is high leading to transmission loss
Solution Approach 1:
The patent modifies the chemical structure of polyimide by introducing specific side chain configurations (Formula 1 structures with R1-R6 groups) to reduce the dielectric constant. This involves changing molecular parameters such as ring structures with 5 or more membered rings in side chains, and adjusting polymerizable group values to 0.2-5 mmol/g, thereby reducing polarizability and achieving lower dielectric constants while maintaining reliability
Solution Approach 2:
The invention creates a composite resin composition combining polyimide or polyimide precursor with polymerizable compounds and polymerization initiators. This composite system allows the polyimide to provide excellent heat resistance and insulating properties while the polymerizable components enable crosslinking to reduce dielectric constant, thus resolving the contradiction between maintaining reliability and reducing transmission loss
2Reliability
If polyimide with high polar group content is used, then insulating properties and heat resistance are improved, but dielectric constant increases causing transmission loss
Solution Approach 1:
The patent applies local quality by strategically placing specific structural features at particular locations in the polyimide molecule. The side chains contain ring structures with 5 or more membered rings (Formula 1) that locally reduce polarizability without compromising the overall insulating matrix. This localized structural modification reduces dielectric constant while maintaining the bulk insulating properties provided by the polyimide backbone
Solution Approach 2:
The invention changes the chemical parameters of the polyimide structure by controlling the polymerizable group value (0.2-5 mmol/g) and introducing specific repeating units (Formulae 2-1 and 3-1). These parameter changes reduce the overall polar group content and polarizability of the material, thereby lowering the dielectric constant while preserving essential insulating properties through the maintained polyimide network structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves a cured substance with a low dielectric constant, suitable for forming insulating films in semiconductor devices, thereby reducing transmission loss and enhancing device performance.
Implementation Method 1
a polymerization initiator; and a polymerizable compound
Data Source
AI summary
Provided are a resin composition containing at least one resin selected from the group consisting of a polyimide and a precursor thereof and having a ring structure with 5 or more membered rings in a side chain, a polymerization initiator, and a polymerizable compound; a cured substance; a laminate; a manufacturing method for a cured substance; a manufacturing method for a laminate; a manufacturing method for a semiconductor device; and a semiconductor device.