Polyimide Resin Molding Processability Heat Resistance

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Solution Overview

Problem

Polyimide resins face challenges in achieving both high molding processability and heat resistance, particularly in maintaining heat aging resistance, due to their high melting points and rigidity, which limits their applications in environments requiring both mechanical strength and thermal stability.

Innovation Solution

A polyimide resin is developed with specific structural units and end groups, including a repeating structural unit with an alicyclic hydrocarbon structure and a chain aliphatic group, optimized in content ratio and structure to enhance molding processability and heat aging resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a polyimide resin is designed to have high heat resistance and rigidity, then thermal stability and strength are improved, but molding processability deteriorates due to high melting point and low flowability

Engineering Contradiction:
Improveheat resistanceVSAvoidmolding processability
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The invention changes the chemical structure parameters of the polyimide resin by introducing specific structural units (formulae 1-4) with controlled ratios, and modifies end groups to achieve optimal balance between heat resistance and molding processability. The melting point is controlled to 250-400°C and glass transition temperature to 150-250°C through these parameter adjustments.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The invention creates a composite polyimide resin structure by combining multiple different structural units (formulae 1-4) in specific ratios. This composite approach allows the resin to exhibit both high heat resistance from aromatic structures and improved molding processability from aliphatic chain segments.

Inventive Principle:
Principle #40Composite materials

2Ease of manufacture

If the melting point of polyimide resin is decreased to improve molding processability, then ease of manufacture is improved, but heat resistance and strength deteriorate

Engineering Contradiction:
Improvemolding processabilityVSAvoidheat resistance
Core Design Contradiction:
Ease of manufactureVSTemperature

Solution Approach 1:

The invention optimizes the molecular structure parameters by controlling the types and ratios of structural units, achieving a melting point range of 250-400°C and glass transition temperature of 150-250°C. This parameter optimization allows both good molding processability and maintained heat resistance.

Inventive Principle:
Principle #35Parameter changes

3Strength

If a polyimide resin is designed for high strength and rigidity, then mechanical strength is improved, but thermoplasticity deteriorates due to molecular chain rigidity

Engineering Contradiction:
Improvemechanical strengthVSAvoidthermoplasticity
Core Design Contradiction:
StrengthVSEase of operation

Solution Approach 1:

The invention applies local quality by introducing flexible aliphatic chain segments (R2 groups with 5-16 carbon atoms) at specific locations in the molecular chain. These local flexible segments provide thermoplasticity while the aromatic structures (X1 and X2 groups) maintain overall strength and rigidity.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The invention changes the molecular chain flexibility parameters by incorporating structural units with aliphatic chains of controlled length (5-16 carbon atoms). This parameter adjustment enables thermoplasticity while maintaining mechanical strength through the aromatic structural components.

Inventive Principle:
Principle #35Parameter changes

4Ease of manufacture

If polyimide resin is processed at high temperature and high pressure for prolonged time to achieve good molding, then molding processability is improved, but production cost increases

Engineering Contradiction:
Improvemolding processabilityVSAvoidproduction cost
Core Design Contradiction:
Ease of manufactureVSUse of energy by stationary object

Solution Approach 1:

The invention changes the processing temperature parameter by designing a resin with melting point of 250-400°C, which is lower than conventional high-performance polyimides. This allows molding at reduced temperature and pressure, decreasing energy consumption and production cost while maintaining good molding processability.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentEP3272786B1Polyimide resin
Publication Date: 2019.12.18 MITSUBISHI GAS CHEM CO INC
  • EP3272786B1 patent drawing
  • EP3272786B1 patent drawing
  • EP3272786B1 patent drawing

AI summary

A polyimide resin containing a repeating structural unit represented by the following formula (1) and a repeating structural unit represented by the following formula (2), a content ratio of the repeating structural unit of formula (1) with respect to the total of the repeating structural unit of formula (1) and the repeating structural unit of formula (2) being 20 to 70 mol%, and the polyimide resin having a chain aliphatic group having from 5 to 14 carbon atoms at an end thereof: wherein R1 represents a divalent group having from 6 to 22 carbon atoms containing at least one alicyclic hydrocarbon structure R2 represents a divalent chain aliphatic group having from 5 to 16 carbon atoms; and X1 and X2 each independently represent a tetravalent group having from 6 to 22 carbon atoms containing at least one aromatic ring.