Polyimide Resin Composition for High-Resolution Semiconductor Patterning
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Solution Overview
Problem
Existing resin compositions used in semiconductor devices face challenges in achieving high resolution for pattern formation, particularly in re-distribution wiring, due to issues with pattern swelling and defects during development.
Innovation Solution
A resin composition comprising polyimide or its precursor, a polymerizable compound, and a polymerization initiator, with specific molecular weight, ring structure, and ethylenically unsaturated bonds, exhibits a controlled dissolution rate and high resolution, minimizing pattern defects and swelling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional resin compositions are used for pattern formation, then manufacturing adaptability is maintained, but resolution deteriorates due to pattern swelling and defects during development
Solution Approach 1:
The patent applies parameter changes by precisely controlling the dissolution rate of the resin composition within a specific range (0.01 to 0.55 μm/sec). This parameter optimization prevents excessive pattern swelling during development while maintaining manufacturing adaptability, thereby resolving the contradiction between resolution improvement and defect prevention.
Solution Approach 2:
The patent employs composite materials by combining polyimide or its precursor with specific polymerizable compounds and polymerization initiators in a controlled composition ratio. This composite formulation achieves both high resolution through controlled dissolution and reduced pattern defects through the synergistic properties of the combined materials.
2Productivity
If dissolution rate is increased to improve pattern formation speed, then productivity increases, but manufacturing precision deteriorates due to pattern swelling
Solution Approach 1:
The patent resolves this contradiction by identifying and optimizing the dissolution rate parameter within a specific range (0.01 to 0.55 μm/sec). This optimized parameter range balances pattern formation speed with resolution, preventing the excessive swelling that occurs at higher dissolution rates while maintaining acceptable productivity.
Solution Approach 2:
The patent applies dynamics by making the dissolution rate controllable and adjustable within a specific range rather than fixed at maximum. This dynamic control allows the process to adapt between speed and precision requirements, resolving the trade-off between productivity and manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves high resolution and reduced pattern defects, ensuring excellent adhesion and preventing pattern collapse, suitable for forming interlayer insulating films in semiconductor devices.
Implementation Method 1
a polymerizable compound; and a polymerization initiator
Implementation Method 2
a dissolution rate of a film having a film thickness of 10 μm, which is obtained from the resin composition, in cyclopentanone is 0.01 to 0.55 μm/sec
Data Source
AI summary
Provided are a resin composition including at least one resin selected from the group consisting of polyimide and a precursor of the polyimide, a polymerizable compound, and a polymerization initiator, in which a dissolution rate of a film having a film thickness of 10 μm, which is obtained from the resin composition, in cyclopentanone is 0.01 to 0.55 μm/sec, a cured substance obtained by curing the composition, a laminate including the cured substance, a manufacturing method for a cured substance, a manufacturing method for a laminate, a manufacturing method for a semiconductor device including the method for a cured substance, and a semiconductor device including a cured substance.