Polyimide Resin Composition for Semiconductor Tackiness
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Solution Overview
Problem
Existing tackiness agents used in electronic device production, such as acryl-based and silicone-based resins, face issues with heat resistance and volatile component production at high temperatures, leading to inadequate performance in high-temperature environments and difficulty in peeling at room temperature after heat treatment.
Innovation Solution
A resin composition comprising a polyimide-based resin with an acid dianhydride residue and a diamine residue, including a polysiloxane-based diamine and an aromatic diamine with a hydroxyl group, which provides excellent heat resistance and tackiness at low temperatures while minimizing volatile component production and adhesive force increase during heat treatment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If acryl-based resin is used as a tackiness agent, then transparency and low-temperature tackiness are improved, but heat resistance deteriorates due to decomposition and volatile component production at temperatures ≥200°C
Solution Approach 1:
The patent uses a composite resin system combining acryl-based resin with silicone-based resin and polyimide resin. This composite formulation allows the material to exhibit both the transparency and low-temperature tackiness of acryl resin while gaining the heat resistance of silicone and polyimide components, preventing decomposition and volatile component production at high temperatures.
2Reliability
If silicone-based resin is used as a tackiness agent, then heat resistance is improved with wide working temperature range, but volatile component production increases at temperatures ≥250°C due to decomposition
Solution Approach 1:
The patent combines silicone-based resin with polyimide resin and acryl-based resin in a composite formulation. The polyimide component provides superior thermal stability that suppresses decomposition and reduces volatile component production at temperatures ≥250°C, while maintaining the heat resistance benefits of the silicone-based resin.
3Reliability
If polyimide resin is used to improve heat resistance at 250°C or higher, then thermal stability is improved, but low-temperature tackiness and pressure bonding capability deteriorate
Solution Approach 1:
The patent creates a composite resin system where polyimide resin provides the heat resistance foundation, while acryl-based resin and silicone-based resin components are added to restore low-temperature tackiness and pressure bonding capability. This composite approach allows the material to exhibit both high-temperature stability and low-temperature adhesiveness.
Solution Approach 2:
The patent adjusts the compositional parameters of the resin system by controlling the ratios of polyimide resin, silicone-based resin, and acryl-based resin. By optimizing these parameters, the material achieves a balance where it maintains heat resistance at high temperatures while recovering sufficient tackiness at low temperatures for effective pressure bonding.
4Ease of operation
If tackiness agent is used for pressure bonding at low temperatures ≤180°C, then initial tackiness is improved, but adhesive force increases after heat treatment making peeling difficult at room temperature
Solution Approach 1:
The patent uses a composite resin formulation where the combination of acryl-based resin, silicone-based resin, and polyimide resin creates a balanced adhesive system. The acryl component provides initial tackiness for easy pressure bonding at low temperatures, while the silicone and polyimide components control the adhesive force increase during heat treatment, allowing manageable peeling strength at room temperature after heat exposure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition exhibits high heat resistance, maintaining good tackiness at low temperatures and preventing adhesive force increase, allowing easy peeling at room temperature, even after heat treatment, and is suitable for use in semiconductor apparatus production.
Implementation Method 1
oligosiloxane bonds to condense and form crosslinking structures
Implementation Method 2
oligosiloxane bonds to condense and form crosslinking structures
Implementation Method 3
resin absorbs moisture and causes outgassing or resin deterioration
Data Source
AI summary
[Problem] To provide a highly heat resistant resin composition which exhibits good tackiness at low temperatures less than or equal to 180°C, and whose production of a volatile portion due to decomposition or the like is small even at high temperatures greater than or equal to 250°C, and whose increase in adhesive force is small even after passage through a heat treatment step, and therefore which allows a base material to be easily peeled off at room temperature when the base material is to be peeled off, and a cured membrane and a laminate film that employ this resin composition. [Solution Means] A resin composition containing a polyimide-based resin and a methylol-based compound, the resin composition being characterized in that the polyimide-based resin has an acid dianhydride residue and a diamine residue, and has as the diamine residue at least a residue of a polysiloxane-based diamine represented by General formula (1) and a residue of an aromatic diamine having a hydroxyl group, and a cured product and a laminate film that employ this resin composition. (n is a natural number, and an average value thereof calculated from an average molecular weight of the polysiloxane-based diamine is in a range of 5 to 30. R1 and R2 may be individually the same or different, indicating an alkylene group or a phenylene group whose carbon number is 1 to 30. R3 to R6 may be individually the same or different, indicating an alkyl group, a phenyl group or a phenoxy group whose carbon number is 1 to 30.)