Polyimide RFID Tag for Inventory Tracking at 1100°F
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Solution Overview
Problem
Existing RFID tags are not suitable for environments exceeding 400°F due to high costs and specialized printers required for metal tags, and there is a need for flexible, printable, and high-temperature-resistant tags for inventory tracking.
Innovation Solution
A polyimide-based RFID tag with a flexible base and embedded RFID element, coated with a printable layer, allowing standard printing and attachment to inventory items, capable of withstanding temperatures up to 1100°F.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If metal tags are used for high temperature environments above 400°F, then temperature resistance is improved, but cost and printer specialization increase
Solution Approach 1:
The patent changes the material parameter from metal to polyimide, which maintains high temperature resistance (up to 1100°F) while eliminating the need for specialized metal printing equipment and reducing costs. The polyimide base member can be printed with standard printers, resolving the contradiction between temperature resistance and ease of manufacture.
Solution Approach 2:
The patent uses a composite structure combining polyimide base member with RFID element and printable coating. This composite material approach provides both high temperature resistance and standard printing compatibility, avoiding the need for specialized metal tags and printers while maintaining functionality in high temperature environments.
2Temperature
If rigid plastic and ceramic tags are used for temperatures up to 400°F, then temperature resistance is improved, but flexibility and printability are reduced
Solution Approach 1:
The patent changes the material from rigid plastic/ceramic to polyimide, which maintains temperature resistance above 400°F while providing flexibility and standard printability. The polyimide base member can be easily printed with standard printers and bent or conform to surfaces, resolving the contradiction between temperature resistance and ease of operation.
Solution Approach 2:
The patent employs a flexible polyimide base member that can be bent or conform to surfaces while withstanding high temperatures. This flexible thin film structure provides both temperature resistance and ease of operation, allowing the tag to be attached to various surfaces and bent without breaking, unlike rigid plastic or ceramic tags.
3Ease of manufacture
If standard printing methods are used for RFID tags, then ease of manufacture is improved, but temperature resistance is reduced
Solution Approach 1:
The patent changes the base member material to polyimide, which can withstand high temperatures while being compatible with standard printing methods. The printable coating on the polyimide base member allows standard printing while the polyimide substrate maintains temperature resistance, resolving the contradiction between ease of manufacture and temperature resistance.
Solution Approach 2:
The patent uses a composite structure with polyimide base member and printable coating. This composite allows standard printing methods to be used while maintaining high temperature resistance, as the polyimide substrate provides thermal stability and the coating provides printability. This resolves the contradiction between ease of manufacture and temperature resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables real-time tracking of high-temperature inventory items from manufacturing processes, maintaining functionality through cooling and beyond, using standard printing methods and materials.
Implementation Method 1
a base member made from a polyimide material... capable of withstanding temperatures up to 1100°F
Data Source
AI summary
A high temperature radio frequency identification (RFID) tag component is disclosed that includes a base member made from a polyimide material and an attached radio frequency identification element. The high temperature radio frequency tag component is adapted for attachment to goods, inventory items, and/or assets that are at an elevated temperature, or to an inventory item or asset that is within an environment at an elevated temperature above 400° F.


