Polyimide RFID Tag Holder for High-Temperature Inventory Tracking
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Solution Overview
Problem
There is a need for a non-metallic tag that is flexible, easily printable, and capable of electronically identifying and tracking inventory items using an RFID element, while being usable at both ambient and high temperatures above 400°F, and a system to support tags for easy viewing while maintaining a safe distance from high-temperature items.
Innovation Solution
The development of a high-temperature RFID tag component featuring a polyimide base member and an attached RFID element, along with a metal wire attachment component that maintains a spacing of approximately 3 to 6 inches between the RFID element and the inventory item, allowing for real-time tracking of items even when they are still hot.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional RFID tags are used, then they can be easily printable and flexible, but they cannot withstand temperatures above 400°F
Solution Approach 1:
The patent uses a composite structure combining a heat-resistant polyimide substrate with an RFID element. The polyimide substrate provides high-temperature stability while the RFID element provides identification functionality, creating a composite material solution that achieves both temperature resistance and tag reliability.
Solution Approach 2:
The patent changes the material parameter of the substrate from conventional plastic to polyimide, which has superior thermal stability. This parameter change enables the tag to withstand temperatures above 400°F while maintaining its structural integrity and functionality.
2Temperature
If metal tags are used for high temperature environments, then temperature resistance is improved, but cost and printing complexity increase
Solution Approach 1:
The patent changes the substrate material parameter from metal to polyimide, which maintains high-temperature resistance while enabling standard printing processes. This parameter change simplifies manufacturing by allowing conventional printing techniques to be used on the heat-resistant substrate.
3Ease of operation
If the RFID tag is placed close to the inventory item, then viewing is easier, but the tag is exposed to higher temperatures
Solution Approach 1:
The patent introduces a heat-resistant polyimide substrate as an intermediary between the RFID element and the hot inventory item. This intermediary protects the RFID element from direct thermal exposure while allowing the tag to be positioned close to the inventory item for easy viewing and scanning.
4Temperature
If the tag is spaced away from the inventory item, then temperature exposure is reduced, but the tag becomes less visible and harder to scan
Solution Approach 1:
The patent changes the thermal resistance parameter of the polyimide substrate to a high level, which allows the tag to be positioned closer to the inventory item without overheating. This parameter change enables the tag to maintain both visibility and temperature protection simultaneously.
Data Source
AI summary
A high temperature radio frequency identification (RFID) tag assembly that includes: a base member made from a polyimide material; a radio frequency identification element attached to the base member, wherein the base member is configured to protect the radio frequency identification element from an inventory item at an elevated temperature above 400° F.; and an attachment component. The attachment component is coupled to the radio frequency identification element and the inventory item and configured to maintain a spacing of approximately 3 to 6 inches between the element and the inventor item. Further, the attachment component is a metal wire.