Thermally Conductive Polyimide Sheet for Semiconductor Heat Dissipation
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Solution Overview
Problem
Existing thermally conductive sheets used in semiconductor processing and heat dissipation applications face issues with adhesiveness, thermal responsiveness, and heat resistance, particularly due to high elastic modulus and insufficient heat resistance at elevated temperatures.
Innovation Solution
A resin composition comprising a polyimide resin with 60 mol% or more of a specific diamine residue, a thermosetting resin, and a thermally conductive filler, where the filler constitutes 60 parts by volume or more of the total composition, enhancing adhesiveness, thermal conductivity, and heat resistance while reducing elastic modulus.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermally conductive sheet with high thermal conductivity is used, then heat dissipation performance is improved, but the elastic modulus becomes too high causing insufficient adhesiveness to the base material
Solution Approach 1:
The patent employs a composite material system consisting of a polyimide resin matrix containing 60 mol% or more of a specific diamine residue (Formula 1) combined with a thermosetting resin and thermally conductive filler. This composite structure allows the material to simultaneously achieve high thermal conductivity through the filler while maintaining low elastic modulus and good adhesiveness through the flexible polyimide resin matrix with thermosetting reinforcement.
Solution Approach 2:
The patent changes the chemical composition parameters of the polyimide resin by specifying that it must contain 60 mol% or more of a diamine residue with a specific structure (Formula 1). This parameter change in the resin composition enables the material to achieve the optimal balance between thermal conductivity, elastic modulus, and adhesiveness, resolving the contradiction between high thermal performance and bonding capability.
2Strength
If the elastic modulus is reduced to improve adhesiveness, then bonding to base material is improved, but thermal responsiveness deteriorates
Solution Approach 1:
The composite material combines a polyimide resin with specific diamine residue content (60 mol% or more of Formula 1) and a thermosetting resin in specific proportions. This composite structure achieves low elastic modulus for good adhesiveness while the high thermally conductive filler content (60 parts by volume or more per 100 parts by volume of total composition) ensures excellent thermal responsiveness.
Solution Approach 2:
The patent optimizes the chemical composition parameters by specifying the diamine residue content (60 mol% or more of Formula 1) and the thermally conductive filler volume fraction (60 parts by volume or more per 100 parts by volume total). These parameter changes enable the material to simultaneously achieve low elastic modulus for bonding and high thermal conductivity for rapid heat response.
3Temperature
If existing resin compositions are used to achieve high thermal conductivity, then heat dissipation is improved, but heat resistance at elevated temperatures becomes insufficient
Solution Approach 1:
The patent creates a composite material system combining a polyimide resin with specific diamine residue content (60 mol% or more of Formula 1) and a thermosetting resin. This composite structure provides both high thermal conductivity through the filler and excellent heat resistance up to 250°C or higher through the thermally stable polyimide-thermosetting resin matrix, resolving the contradiction between thermal conductivity and heat resistance.
Solution Approach 2:
The patent changes the chemical composition parameters by specifying that the polyimide resin must contain 60 mol% or more of a diamine residue with the specific structure in Formula 1. This parameter change in the resin chemistry enhances the material's thermal stability and heat resistance while maintaining high thermal conductivity, allowing the sheet to withstand temperatures of 250°C or higher without degrading.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves a thermally conductive sheet with improved adhesiveness, thermal conductivity, and heat resistance, effectively addressing the limitations of existing materials by providing a low elastic modulus and enhanced thermal responsiveness.
Implementation Method 1
a resin composition containing a polyimide resin, a thermosetting resin, and a thermally conductive filler... to transfer the heat generated from a semiconductor module such as a power semiconductor to a heat sink and efficiently dissipate the heat
Implementation Method 2
these thermally conductive sheets are required to have a low elastic modulus so that they can adhere to the base material according to the shape of the base material
Data Source
AI summary
A resin composition including: (A) a polyimide resin containing 60 mol% or more of a diamine residue having a structure represented by General Formula (1) below in all diamine residues; (B) a thermosetting resin; and (C) a thermally conductive filler, wherein the resin composition contains 60 parts by volume or more of the thermally conductive filler (C) in 100 parts by volume of a total of the polyimide resin (A), the thermosetting resin (B), and the thermally conductive filler (C). Provided is a resin composition capable of providing a sheet that is excellent in heat resistance and thermal conductivity, has a low elastic modulus, and is excellent in thermal responsiveness.