Polyimide Layered Product Slip Agent Segmentation
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Solution Overview
Problem
Current methods for producing polyimide layered products with inorganic substrates face challenges such as surface roughness, dimensional instability, and adhesion issues, particularly at high temperatures, limiting their suitability for flexible electronic devices with fine wiring and high thermal performance.
Innovation Solution
A method involving a polyimide film with a slip agent-free surface layer and a coupling agent-treated layer, subjected to pressurizing and heating, followed by organic alkali treatment and imidization, to create a layered product with differential adhesion/peel strength, allowing for smooth surface preparation and easy release from the substrate without using adhesive agents.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a polyimide film is bonded to an inorganic substrate using conventional methods, then the film can be supported during processing, but the film surface becomes rough and adhesion fails at high temperatures
Solution Approach 1:
The invention segments the polyimide film into multiple layers: a support-contact layer with slip agent for bonding and release, and a device-forming layer without slip agent for smooth surface and fine wiring. This segmentation allows each layer to perform its specific function optimally without compromising the other.
Solution Approach 2:
Different regions of the polyimide film structure are given different properties: the lower layer near the substrate has slip agent for adhesion control, while the upper surface layer has no slip agent for smoothness. This local quality differentiation resolves the contradiction between adhesion and surface quality.
2Ease of operation
If a polyimide film with slip agent is used for easy release from substrate, then handling is improved, but surface roughness increases preventing fine wiring formation
Solution Approach 1:
The film is segmented into functional layers: the lower layer contains slip agent for easy release, while the upper layer is slip agent-free for smooth surface suitable for fine wiring. This segmentation allows both release ease and wiring precision to be achieved simultaneously.
Solution Approach 2:
The slip agent is localized to specific layers (support-contact layer) rather than distributed throughout the entire film. This local quality approach enables the release function to be achieved without compromising the surface quality needed for fine wiring in the device-forming layer.
3Reliability
If adhesive agents are used to bond polyimide film to substrate, then adhesion is improved, but the bonding process becomes complex and requires additional materials
Solution Approach 1:
The invention uses a coupling agent as an intermediary substance applied to the inorganic substrate surface. This coupling agent mediates the bonding between the substrate and polyimide film, providing strong adhesion through chemical bonding while keeping the process relatively simple and avoiding the need for complex adhesive formulations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the production of polyimide layered products with enhanced heat resistance, surface smoothness, and dimensional stability, facilitating the formation of sophisticated circuits and devices with reduced defects and improved handling, particularly suitable for high-temperature processes.
Implementation Method 1
applying a polyamic acid solution (A) free from a slip agent ingredient, drying the coating film and imidizing the film
Implementation Method 2
subjecting at least one of a face of the support and the face of the polyimide film which are opposite to each other to a patterning treatment using a coupling agent to form a satisfactorily bondable part and an easily releasable part which differ in adhesion/peel strength
Implementation Method 3
superposing the support and the polyimide film to be subjected to a pressurizing/heating treatment
Implementation Method 4
superposing the support and the polyimide film to be subjected to a pressurizing/heating treatment
Implementation Method 5
subjecting the polyimide film to an organic alkali treatment after the polyimide film is bonded to the support by the pressurizing/heating treatment
Data Source
AI summary
By preparing a polyimide film with a face at the support side and subjected to a surface treatment; subjecting at least one of a face of the support and the face of the polyimide film which are opposite to each other to a patterning treatment using a coupling agent to form a satisfactorily bondable part and an easily releasable part which differ in adhesion/peel strength; subsequently, superposing the support and the polyimide film to be subjected to a pressurizing/heating treatment and to be bonded to each other, subjecting the surface of the polyimide film to an organic alkali treatment; and then, applying a polyamic acid solution free from a slip agent ingredient, drying the coating film and imidizing the film, a layered product having a structure of at least three layers in which at least one layer contains a slip agent material and both surface layers have no slip agent material is produced.