Polyimide Substrate with Hollow Silica Particles for Heat Resistance

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Solution Overview

Problem

Existing transparent polymer bases for electronic equipment, such as those used in flexible devices, face challenges with high heat resistance, as they tend to experience thermal decomposition and discoloration when exposed to temperatures above 320°C, impairing their transparency and mechanical strength.

Innovation Solution

A heat-resistant base is developed by dispersing hollow particles within a specific polyimide-based resin, which includes a modified polyimide with a thermo-curable or photo-curable functional group and a structure incorporating fluoro atom-containing substituents, providing enhanced thermal stability and optical properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Weight of moving object

If a transparent polymer base is used to replace glass substrate, then weight is reduced and flexibility is improved, but heat resistance deteriorates causing thermal decomposition above 320°C

Engineering Contradiction:

ImproveweightVSAvoidheat resistance

Core Design Contradiction:

Weight of moving objectVSTemperature

Solution Approach 1:

The patent uses a composite material system consisting of polyimide resin as the base polymer and silica hollow particles as filler. This composite structure combines the lightweight and flexible properties of polymer materials with the high heat resistance of inorganic silica particles, enabling the substrate to withstand temperatures above 320°C while maintaining transparency and mechanical properties.

Inventive Principle:

Principle #40Composite materials

2Adaptability or versatility

If a transparent polymer base is used to replace glass substrate, then flexibility is improved, but strength deteriorates under high temperature conditions

Engineering Contradiction:

ImproveflexibilityVSAvoidstrength

Core Design Contradiction:

Adaptability or versatilityVSStrength

Solution Approach 1:

The silica hollow particles dispersed in the polyimide resin matrix create a composite structure that enhances mechanical strength while preserving flexibility. The hollow particle structure provides reinforcement without significantly increasing weight, and the composite maintains flexibility needed for flexible displays while withstanding high temperature processing conditions.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The hollow particles are strategically dispersed throughout the polymer matrix to provide localized reinforcement. This creates regions of enhanced strength and heat resistance within the flexible polymer substrate, allowing the material to maintain overall flexibility while having distributed points of structural support that prevent deformation at high temperatures.

Inventive Principle:

Principle #3Local quality

3Temperature

If conventional polyimide resin is used, then heat resistance is improved, but transparency deteriorates due to discoloration at high temperatures

Engineering Contradiction:

Improveheat resistanceVSAvoidtransparency

Core Design Contradiction:

TemperatureVSIllumination intensity

Solution Approach 1:

The combination of polyimide resin and silica hollow particles creates a composite that resists thermal decomposition and discoloration. The silica particles stabilize the polymer matrix at high temperatures, preventing the yellowing and cloudiness that typically occurs in conventional polyimide resins, thereby maintaining optical transparency even after exposure to temperatures above 320°C.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The silica hollow particles act as an intermediary stabilizing agent between the polymer chains and thermal energy. They absorb and dissipate thermal stress, preventing direct thermal degradation of the polyimide resin structure that would lead to discoloration. This intermediary role of the silica particles protects the optical properties while allowing heat resistance to be maintained.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution maintains transparency and mechanical strength at high temperatures, preventing discoloration and ensuring the base's functionality as a substitute for glass in electronic equipment, including displays and thin film transistors.

Implementation Method 1

by forming with a specific polyimide-based resin and a hollow particle dispersed therein, an improved (high) heat resistant base for electronic equipment having transparency, heat resistance and mechanical strength

Methodology Applied

Scientific EffectThermal stability enhancement through hollow particle dispersion:

Implementation Method 2

transparent polyimide resins such as fluorinated polyimide resins... have been proposed

Methodology Applied

Scientific EffectThermal resistance through fluorinated polyimide structure:

Data Source

PatentUS20220195118A1Substrate for heat-resistant electronic device

Publication Date: 2022.06.23 LG CHEM LTD

AI summary

The present disclosure proposes an improved heat resistant base for electronic equipment having transparency, heat resistance and mechanical strength and also having superior optical properties and quality, and thereby capable of replacing a transparent glass base.The present disclosure is accomplished by the heat resistant base for electronic equipment including a polyimide-based resin and a hollow particle, wherein a plurality of the hollow particles are dispersed and present in the polyimide-based resin, and the hollow particle has an average particle diameter of greater than or equal to 10 nm and less than or equal to 300 nm.