Thermally Conductive Polyimide Substrate for Heat Dissipation
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Solution Overview
Problem
Conventional polyimide substrates with lower thermal conductivity fail to meet industrial needs due to increased heat generation in densely designed circuits, leading to overheating issues.
Innovation Solution
A thermally conductive type polyimide substrate is developed, comprising a photosensitive polyimide resin with inorganic fillers and silica solution, enhancing thermal conductivity and photosensitivity, allowing for improved heat dissipation without the need for additional photoresist layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional polyimide is used for insulating layers, then the substrate has good insulation and chemical resistance, but the thermal conductivity is too low to handle heat from intensive circuit design
Solution Approach 1:
The patent uses composite materials by incorporating inorganic fillers (alumina, boron nitride, silica, or their combinations) into the polyimide matrix to create a thermally conductive photosensitive resin. This composite structure maintains the insulation properties of polyimide while significantly enhancing thermal conductivity to 0.4-2.0 W/mK, resolving the contradiction between insulation and heat dissipation.
Solution Approach 2:
The patent changes the thermal conductivity parameter of the polyimide material from conventional low values to 0.4-2.0 W/mK by adding inorganic fillers. This parameter change enables the material to effectively conduct heat while maintaining its insulating properties, allowing the substrate to handle heat from intensive circuit design.
2Ease of manufacture
If conventional polyimide is used for etching processes, then additional photoresist layers must be applied, but this increases process complexity and manufacturing steps
Solution Approach 1:
The photosensitive polyimide resin serves multiple functions simultaneously: it acts as the insulating layer, the photoresist for patterning, and the structural material for the substrate. This multi-functionality eliminates the need for separate photoresist layers, simplifying the manufacturing process and reducing the number of layers while maintaining etching capability.
Solution Approach 2:
The patent merges the insulating layer and photoresist layer into a single photosensitive polyimide layer. This consolidation combines the functions of electrical insulation and photopatterning into one material, reducing process complexity and eliminating the need for additional photoresist application steps.
3Temperature
If inorganic fillers are added to enhance thermal conductivity, then heat dissipation improves, but the photosensitivity and manufacturing precision may be affected
Solution Approach 1:
The patent optimizes the concentration of inorganic fillers to maintain photosensitivity while enhancing thermal conductivity. By controlling the filler content and selecting appropriate filler types (alumina, boron nitride, silica), the resin achieves thermal conductivity of 0.4-2.0 W/mK while retaining sufficient photosensitivity for precise photopatterning and manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermally conductive polyimide substrate effectively reduces operating temperatures by up to 40% compared to conventional substrates, maintaining excellent photosensitivity and simplifying the manufacturing process through direct exposure and development without additional photoresist materials.
Implementation Method 1
The material of the insulating layer is a thermally conductive type photosensitive resin having a thermal conductivity of 0.4 to 2 W/mK
Implementation Method 2
The silica solution comprises silica particles polymerized by a sol-gel process
Data Source
AI summary
A thermally conductive type polyimide substrate is provided. The substrate comprises at least one insulating layer having a metal layer on a single side or both sides thereof. The material of the insulating layer is a thermally conductive type photosensitive resin having a thermal conductivity of 0.4 to 2, and the thermally conductive type photosensitive resin includes the following components: (a) a photosensitive polyimide, (b) an inorganic filler, and (c) a silica solution. The photosensitive polyimide accounts for 50 to 70% of a total weight of a solid composition of the thermally conductive type photosensitive resin. The inorganic filler accounts for 20-30% of the total weight of the solid composition of the thermally conductive type photosensitive resin, and has a particle size between 40 nm and 5 μm. The silica solution comprises silica particles polymerized by a sol-gel process, and the silica particles have a particle size between 10 nm and 15 nm and account for 5 to 30% of the total weight of the solid composition of the thermally conductive type photosensitive resin.