Polyimide Film Adhesion via Triazine Precursor

Solution Overview

Problem

Current polyimide films face limitations in achieving high peeling strength when a metal layer is formed on them through dry or wet plating methods, and they often have restricted heat resistance and solubility in organic solvents, which hinders their application in various coatings and electronic devices.

Innovation Solution

A polyimide precursor and solution are developed, incorporating a triazine moiety and specific tetracarboxylic dianhydrides, which form a polyimide film with enhanced adhesiveness to metal layers and improved heat resistance, allowing for the creation of polyimide-metal laminates with improved mechanical and thermal properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a polyimide film is used for metal layer lamination, then heat resistance and chemical resistance are improved, but peeling strength and adhesiveness to metal layers are insufficient

Engineering Contradiction:

Improveheat resistanceVSAvoidpeeling strength

Core Design Contradiction:

TemperatureVSStrength

Solution Approach 1:

The invention modifies the chemical structure of polyimide by introducing specific aromatic diamine components with hydroxyl groups and sultone groups, changing the molecular parameters to achieve both high heat resistance and improved peeling strength simultaneously

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention creates a composite polyimide structure combining aromatic diamine components with hydroxyl groups and sultone groups, achieving synergistic effects that provide both thermal stability and enhanced metal layer adhesion

Inventive Principle:

Principle #40Composite materials

2Temperature

If high heat resistant polyimide is produced by forming a self-supporting film using polyamic acid, then heat resistance is improved, but solubility in organic solvents is reduced

Engineering Contradiction:

Improveheat resistanceVSAvoidsolubility in organic solvents

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The invention modifies the chemical structure of polyimide by introducing specific aromatic diamine components with hydroxyl groups and sultone groups, changing the molecular parameters to achieve both high heat resistance and improved peeling strength simultaneously

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention uses specific aromatic diamine components as intermediary structures that bridge the gap between heat resistance requirements and solvent processability, enabling both high-temperature stability and organic solvent solubility

Inventive Principle:

Principle #24Intermediary (Mediator)

3Stability of the object's composition

If a polyimide film is used for flexible printed circuit boards, then dimensional stability and mechanical strength are improved, but adhesiveness to adhesive and metal layers is insufficient

Engineering Contradiction:

Improvedimensional stabilityVSAvoidadhesiveness

Core Design Contradiction:

Stability of the object's compositionVSStrength

Solution Approach 1:

The invention modifies the chemical structure of polyimide by introducing specific aromatic diamine components with hydroxyl groups and sultone groups, changing the molecular parameters to achieve both high heat resistance and improved peeling strength simultaneously

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS9556312B2Polyimide precursor, polyimide, polyimide film, polyimide metal laminate, and polyimide solution

Publication Date: 2017.01.31 UBE CORPORATION

AI summary

A polyimide precursor, a polyimide using the polyimide precursor, and a polyimide film using the polyimide. The polyimide film has excellent adhesiveness to a metal layer or an adhesive, and has improved heat resistance. The polyimide solution may be used as a coating material.