Polyketanil Release Layers for Low-Debris Wafer Laser Debonding
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Solution Overview
Problem
Existing temporary wafer bonding processes face challenges in achieving high throughput, low stress, and efficient separation of substrates while maintaining bonding integrity, particularly during laser debonding, especially in applications requiring high sensitivity and minimal debris.
Innovation Solution
The use of polyketanils as a release layer in temporary bonding methods, which are formed by polymerizing amine and ketone functional groups, absorbing light at specific wavelengths to facilitate substrate separation with controlled laser energy, allowing for high adhesion and thermal stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional laser release materials are used, then substrate separation can be achieved, but high energy requirements and long debond times result
Solution Approach 1:
The patent changes the optical parameters of the release layer by using polyketanil materials with high absorbance coefficients at specific laser wavelengths (300-400 nm). This parameter change enables the release layer to absorb laser energy more efficiently, reducing both the energy requirement and debond time while maintaining effective substrate separation
Solution Approach 2:
The patent employs composite material structures where polyketanil is integrated into the release layer composition. This composite approach combines the laser-absorbing properties of polyketanil with the adhesive properties of the bonding material, creating a release layer that responds rapidly to laser irradiation and enables fast, low-energy debonding
2Object-generated harmful factors
If existing release materials are used, then debonding can occur, but excessive debris is generated during separation
Solution Approach 1:
The patent designs the release layer as a sacrificial, disposable component that is intentionally designed to decompose cleanly upon laser irradiation. The polyketanil-based release layer breaks down into volatile products that do not leave residual debris on the substrates, eliminating the need for additional cleaning steps and ensuring separation cleanliness
Solution Approach 2:
The patent converts the potentially harmful effect of laser irradiation (which could cause damage or generate debris) into a beneficial decomposition process. By selecting polyketanil materials with appropriate optical and thermal properties, the laser energy is converted into controlled decomposition that produces no harmful residues, transforming a potential harm into a clean separation mechanism
3Strength
If strong bonding is used to maintain bonding integrity, then substrate attachment is secure, but handling stress on fragile wafers increases
Solution Approach 1:
The patent segments the bonding system into distinct functional layers: a bonding layer that provides strong adhesion between substrates and a separate release layer that manages stress and enables separation. This segmentation allows the bonding layer to maintain strong attachment while the release layer absorbs and distributes handling stresses, protecting fragile device wafers during processing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Polyketanils provide efficient substrate separation with reduced debris, lower energy requirements, and improved handling of fragile device wafers through high absorbance and thermal stability, suitable for various integration processes.
Implementation Method 1
the release layer responds to radiation from a laser or other light source, which leads to decomposition of the layer itself
Implementation Method 2
Laser-induced release materials are available for operating at laser wavelengths ranging from ultraviolet (e.g., 248 nm, 308 nm and 355 nm) to near infrared (e.g., 1064 nm) wavelengths
Data Source
Figure 1(a)~1(b)
Figure 2(a)~2(h)
Figure 3
AI summary
Novel polyketanil-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, at wavelengths from about 300 nm to about 360 nm, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are resistant to common solvents used in semiconductor processing. The compositions can also be used as build-up layers for redistribution layer formation.