Polyline Shield Wall for High-Frequency Module Noise Control
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Solution Overview
Problem
High-frequency modules face challenges in reducing deformation or breakage of internal wiring electrodes during shield formation, while maintaining effective shielding characteristics and size reduction, due to limitations in slit formation techniques and structural rigidity.
Innovation Solution
A high-frequency module design featuring a shield wall with polyline shape and projection portions penetrating the surface layer conductor, enhancing connectivity and flexibility, and reducing the risk of breakage by avoiding direct impact on internal wiring electrodes during processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a slit is formed by cutting with a dicing machine to create a shield, then the shield can block noise between components, but it is difficult to change the direction of the slit in its middle and the wiring board is half-cut making it easily broken
Solution Approach 1:
The shield wall is divided into multiple segments that can be independently formed and positioned. Instead of creating a continuous slit through the entire wiring board, the shield is segmented into portions that can be formed separately and connected, reducing the risk of complete board failure while maintaining noise blocking effectiveness.
Solution Approach 2:
The shield wall extends in multiple dimensions - vertically from the first surface toward the second surface of the wiring board, and horizontally with bent portions. This multi-dimensional structure allows the shield to provide effective noise blocking without requiring a complete through-cut of the wiring board, thereby maintaining structural integrity.
2Object-affected harmful factors
If a slit penetrates the ground electrode to ensure electrical connection, then shielding characteristics are maintained, but internal wiring electrodes may be broken or deformed due to impact, heat, or other factors during slit formation
Solution Approach 1:
The shield wall is formed to extend partially toward the second surface of the wiring board rather than completely penetrating through it. This partial action approach provides sufficient shielding effectiveness while avoiding the harmful effects of complete penetration, such as impact, heat, and deformation to internal wiring electrodes.
Solution Approach 2:
The shield wall configuration inherently cushions or protects internal wiring electrodes by not requiring complete penetration. The bent portions and partial extension design prevent direct transmission of formation forces to the internal wiring, thereby protecting them from breakage or deformation before the problematic effects can occur.
3Device complexity
If the shield is formed in a straight line shape, then the structure is simple, but flexibility in arrangement of components is limited and size reduction is difficult
Solution Approach 1:
The shield wall incorporates bent portions that allow it to follow curved or angled paths rather than straight lines only. This curved geometry provides flexibility in adapting to different component arrangements while maintaining structural simplicity and manufacturing feasibility.
Data Source
AI summary
A high-frequency module includes: a multilayer wiring board; a plurality of components mounted on an upper surface of the multilayer wiring board; a sealing resin layer laminated on the upper surface of the multilayer wiring board and sealing the plurality of components; a shield wall disposed within the sealing resin layer and between the predetermined components; and a surface layer conductor disposed between the upper surface of the multilayer wiring board and the shield wall so as to overlap the shield wall in a plan view of the multilayer wiring board. The shield wall is formed in a polyline shape having bent portions in the plan view, and has, at the bent portions, projection portions penetrating the surface layer conductor.