Polymer Adhesive Interposer Bonding for Semiconductor Packaging
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Solution Overview
Problem
The existing three-dimensional semiconductor chip package technology relies on soldering bumps for electrical connections, which are prone to failure due to mechanical stress and high temperature requirements, limiting bonding strength and increasing production costs.
Innovation Solution
A polymer supporting adhesive layer is used to replace soldering bumps, providing a larger interface for bonding between semiconductor chips and interposers, allowing for lower processing temperatures and reduced mechanical stress, while also being more cost-effective for mass production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If soldering bumps are used for bonding semiconductor chips to interposers, then electrical connection is achieved, but the bonding is prone to failure due to mechanical stress and high temperature requirements
Solution Approach 1:
The patent changes the bonding parameters by using a polymer-based adhesive layer instead of traditional soldering bumps. This allows bonding at lower temperatures (below the curing temperature of the polymer) and creates a more mechanically robust connection that is less susceptible to stress-induced failure, thereby improving both reliability and strength simultaneously
Solution Approach 2:
The patent employs a composite adhesive layer comprising a polymer matrix with embedded inorganic fillers or reinforcing structures. This composite structure combines the flexibility and low processing temperature of polymers with the mechanical strength of inorganic materials, resolving the contradiction between bonding reliability and strength
2Temperature
If eutectic bonding is used to achieve metal phase conversion, then bonding is achieved under lower temperature (400-500°C), but strict requirements on temperature and heating cycles make the process sensitive to deformation
Solution Approach 1:
The patent changes the fundamental bonding mechanism from eutectic reaction-based to polymer curing-based, which allows for broader temperature windows and less stringent heating cycle control. The polymer adhesive can be cured through various methods (thermal, UV, moisture) providing flexibility that eliminates the strict temperature precision requirements of eutectic bonding
3Reliability
If soldering bumps are used for connection, then electrical connection is established, but the process has high production cost and is less suitable for mass production
Solution Approach 1:
The patent replaces expensive soldering bumps and complex eutectic bonding processes with a cost-effective polymer adhesive layer that can be applied through standard coating techniques. This significantly reduces material costs and processing complexity, making the method highly suitable for mass production while maintaining connection reliability
Solution Approach 2:
The patent substitutes the mechanical soldering bump system with a chemical bonding system using polymer adhesives. This eliminates the need for precise mechanical alignment and soldering equipment, simplifying the manufacturing process and reducing costs while maintaining or improving connection reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The polymer adhesive layer ensures strong and reliable bonding between semiconductor chips and interposers, reducing the risk of breakage and contamination, and is more suitable for high-density, high-efficiency semiconductor packaging.
Implementation Method 1
A polymer supporting adhesive layer is formed to surround the bump. The polymer supporting adhesive layer couples between the interposer and a semiconductor chip
Data Source
AI summary
A method includes forming a bump on a lower surface of an interposer. A first insulation layer is formed to cover the lower surface and bump. A trench is formed extending from the lower towards an upper surface of the interposer. A polymer supporting adhesive layer is formed to surround the bump and couples between the interposer and a semiconductor chip. The semiconductor chip has at least a sensing component and a conductive pad electrically connected to the sensing component, and the bump is connected to the conductive pad. A via is formed extending from the upper towards the lower surface. A second insulation layer is formed to cover the upper surface and the via. A redistribution layer is formed on the second insulation layer and in the via. A packaging layer is formed to cover the redistribution layer and has a second opening.