Polymer Blend for Electronic Device Impact Resistance

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Solution Overview

Problem

Conventional polymer blends used in electronic communication devices, such as those containing polybutylene terephthalate and polycarbonate with glass fibers, fail to meet the requirements for next-generation materials in terms of notched Izod impact rating, glass transition temperature, and ability to withstand secondary processing conditions.

Innovation Solution

A polymer blend composition comprising 10-30% by weight polycarbonate/siloxane copolymer, 0.5-55% by weight polycarbonate, and 15-75% by weight polycyclohexylenedimethylene terephthalate (PCT), which is formed through extrusion, providing enhanced performance in impact resistance, glass transition temperature, and durability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If conventional PBT/PC blend with glass fiber is used, then material structure is simple and processing is easy, but impact rating is low (150 J/m) and glass transition temperature is low (90.2°C)

Engineering Contradiction:
Improveimpact ratingVSAvoidmaterial composition complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The patent applies composite materials by creating a multi-component polymer blend system comprising PCT (10-70 wt%), PC (10-60 wt%), and PC/siloxane copolymer (5-30 wt%). This complex composite structure achieves a notched Izod impact rating of at least 400 J/m and glass transition temperature of 95-150°C, significantly improving upon the conventional PBT/PC blend's 150 J/m impact rating and 90.2°C glass transition temperature.

Inventive Principle:
Principle #40Composite materials

2Reliability

If conventional PBT/PC blend is used, then manufacturing process is simple, but ability to withstand secondary processing conditions (temperatures up to 100°C) is insufficient

Engineering Contradiction:
Improvewithstand secondary processing conditionsVSAvoidprocessing complexity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent applies parameter changes by modifying the chemical composition parameters of the polymer blend. By incorporating PCT with specific molecular weight (15,000-50,000) and controlling the ratio of PC and PC/siloxane copolymer, the material achieves enhanced thermal stability and reliability to withstand secondary processing conditions at temperatures up to 100°C, while maintaining manufacturability through extrusion processing.

Inventive Principle:
Principle #35Parameter changes

3Strength

If polycarbonate/siloxane copolymer and PCT are added to achieve high impact rating (≥650 J/m), then impact resistance and glass transition temperature improve, but composition complexity increases

Engineering Contradiction:
Improvenotched Izod impact ratingVSAvoidpolymer blend composition
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The patent applies local quality by assigning specific functional roles to each component in the polymer blend. PCT (10-70 wt%) provides the base structure and thermal stability, PC (10-60 wt%) enhances mechanical properties and impact resistance, and PC/siloxane copolymer (5-30 wt%) contributes to flexibility and toughness. This functional differentiation achieves high notched Izod impact rating (≥400 J/m) and glass transition temperature (95-150°C) while managing composition complexity through targeted component selection.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS10696842B2Polymer blend composition for electronic communication devices
Publication Date: 2020.06.30 SHPP GLOBAL TECH BV
  • US10696842B2 patent drawing
  • US10696842B2 patent drawing
  • US10696842B2 patent drawing

AI summary

Compositions formed from a blend of polycarbonate/siloxane copolymer, polycarbonate, and polycyclohexylenedimethylene terephthalate are disclosed that provide superior performance in terms of notched Izod impact, glass transition temperature (Tg), strength after aging, ability to withstand secondary processing conditions, and in other respects. Such compositions exceed critical-to-quality requirements for use in manufacturing components for electronic communication devices.