Polymer Blend Wire Insulation for Partial Discharge Resistance

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Solution Overview

Problem

Existing insulation systems for electrical conductors in the mid-and high-voltage range rely heavily on mica, which is difficult to process and raises sustainability concerns, while conventional polymeric constituents lack partial discharge resistance.

Innovation Solution

A polymer blend comprising at least three blend partners, including a copolymer based on polyetherimide and siloxane, and two high-temperature thermoplastics in semicrystalline form, which provides resistance to partial discharges and replaces mica in insulation systems.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If mica is used in insulation systems to achieve high partial discharge resistance, then partial discharge resistance is improved, but processing difficulty increases and sustainability concerns arise

Engineering Contradiction:
Improvepartial discharge resistanceVSAvoidprocessing difficulty
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The invention changes the material parameters from natural mica to synthetic polymer blends with specific glass transition temperatures (150-250°C) and crystalline structures. This parameter transformation maintains partial discharge resistance while enabling automated processing and eliminating sustainability concerns associated with mica mining and manual processing

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The invention uses composite polymer blends combining at least three different polymer components with complementary properties. This composite approach achieves the high partial discharge resistance previously only attainable with mica, while providing improved processability and mechanical properties through the synergistic combination of polymer constituents

Inventive Principle:
Principle #40Composite materials

2Ease of manufacture

If conventional polymeric constituents are used in insulation systems, then ease of processing is improved, but partial discharge resistance is insufficient

Engineering Contradiction:
Improveease of processingVSAvoidpartial discharge resistance
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The invention modifies the thermal and electrical parameters of conventional polymers by selecting materials with specific glass transition temperatures (150-250°C) and controlling their crystalline structure. This parameter optimization enables the polymers to withstand partial discharge conditions while maintaining ease of processing during manufacturing

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The invention creates composite polymer blends that combine the processability of conventional polymers with enhanced partial discharge resistance. The blend of at least three polymer components provides both the manufacturing advantages of synthetics and the electrical performance previously only achievable with mica

Inventive Principle:
Principle #40Composite materials

3Strength

If mica paper is applied to carrier films to improve mechanical strength and processibility, then mechanical strength is improved, but device complexity and sustainability concerns increase

Engineering Contradiction:
Improvemechanical strengthVSAvoidstructure complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The invention changes from multi-layer mica paper composites to single-phase or multi-phase polymer blends that achieve comparable or superior mechanical strength through controlled crystallization and spherulite formation. This simplifies the structure from multiple discrete layers to a more integrated polymer matrix system

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS20250062051A1Insulation System, Including a Polymer Blend
Publication Date: 2025.02.20 SIEMENS MOBILITY GMBH
  • US20250062051A1 patent drawing
  • US20250062051A1 patent drawing
  • US20250062051A1 patent drawing

AI summary

Various embodiments of the teachings herein include an insulation system. An example includes a polymer blend in the form of a solid two-dimensional insulation material, a material for wire insulation by means of extrusion and/or an injection-molded and/or compression-molded article. The blend is resistant to partial discharges and at least partly replaces any mica content in the insulation system. The blend comprises at least three blend partners including at least one copolymer based on polyetherimide and siloxane blended with at least two high-temperature thermoplastics. At least of one the high-temperature thermoplastics is in semicrystalline form, such that spherulites are detectable in the polymer blend.