Polymer Ceramic Interface Structure for Chip Heat and Isolation
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Solution Overview
Problem
Conventional electronic chip packages face limitations in thermal insulation and reliability due to the lack of sufficient electrical isolation and thermomechanical stability in thermal interface materials, which can lead to reduced performance and increased risk of thermal stress and cracks during operation.
Innovation Solution
The use of a polymer ceramic interface structure with a coefficient of thermal expansion between 7 ppm/K and 30 ppm/K, which combines the benefits of polymeric impact resistance with ceramic high temperature stability, providing efficient heat removal and reliable electrical insulation, is introduced. This interface structure is formed by curing a polymer ceramic preform with ceramic filler particles, allowing for adjustable properties such as thermal conductivity and mechanical robustness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional thermal interface materials are used, then thermal conductivity is improved, but electrical isolation and thermomechanical stability deteriorate
Solution Approach 1:
The patent applies composite materials by combining polymer and ceramic components to create a polymer ceramic interface material. The polymer phase provides electrical isolation and impact resistance, while the ceramic phase delivers high thermal conductivity and temperature stability. This composite structure resolves the contradiction by integrating multiple material functions into a single thermally conductive electrically insulating material that maintains thermomechanical stability during operation cycles.
Solution Approach 2:
The patent employs parameter changes by adjusting the coefficient of thermal expansion of the polymer ceramic to match that of the base body within a specific range (7-30 ppm/K). This parameter optimization ensures thermal compatibility between the interface material and the base body, preventing thermal stress and cracks during temperature variations, thereby improving reliability while maintaining thermal conductivity.
2Reliability
If attachable foil thermal interface material is used, then electrical isolation is improved, but cost and assembly effort increase
Solution Approach 1:
The patent merges the thermal interface material directly with the base body through integral formation, eliminating the need for separate attachable foils. The polymer ceramic interface material is formed as an integral part of the base body structure, combining multiple functions (electrical isolation, thermal conduction, mechanical bonding) into a single manufacturing process. This integration reduces both material cost and assembly steps while maintaining reliable electrical isolation.
3Reliability
If polymer ceramic with optimized CTE is used, then thermomechanical stability is improved, but manufacturing complexity increases
Solution Approach 1:
The patent optimizes the coefficient of thermal expansion parameter of the polymer ceramic within a specific range (7-30 ppm/K) to match the base body. This parameter control ensures thermal compatibility and prevents cracking during temperature cycles. The manufacturing process achieves this optimization through controlled curing conditions and material composition adjustment, balancing thermomechanical stability with manufacturability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The polymer ceramic interface structure enhances the reliability and thermal performance of electronic components by reducing thermal stress and improving mechanical robustness, enabling efficient heat dissipation and reliable electrical insulation, even in harsh environments.
Implementation Method 1
an electrically insulating and thermally conductive interface structure attached to the base body and comprising a polymer ceramic
Implementation Method 2
A coefficient of thermal expansion of the cured polymer ceramic is in a range between 7 ppm/K and 30 ppm/K
Data Source
Figure 1~4
AI summary
An assembly unit (140) for coupling with an electronic chip (104) of an electronic component (100), the assembly unit (140) comprising a base body (138), and an electrically insulating and thermally conductive interface structure (108) attached to the base body (138) and comprising a polymer ceramic.