Polymer-Assisted Chip Transfer via Segmented Adhesive Layers
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Solution Overview
Problem
Conventional adhesive tapes used in chip transfer processes are unsuitable for ultra-fine-pitch interconnects, as they provide either too strong or too weak adhesion, leading to damage or misalignment of semiconductor devices during transportation and processing, such as laser lift-off.
Innovation Solution
The use of one or more adhesive layers with controlled adhesion strength to secure chips to an intermediate carrier substrate, allowing for gradual reduction of adhesion during chip transfer, using materials like waxes and polymers with different properties to facilitate secure attachment and controlled release.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional adhesive tapes are used to secure chips during chip transfer, then chips can be held in place during transportation, but the adhesion strength is either too strong or too weak causing damage or misalignment to ultra-fine-pitch interconnects
Solution Approach 1:
The adhesive system is segmented into multiple layers with different adhesion strengths and removal characteristics. The first adhesive layer provides strong initial bonding for secure chip attachment, while the second adhesive layer enables controlled release. This segmentation allows the system to provide both strong holding force during transport and gentle release capability to protect ultra-fine-pitch interconnects from damage
Solution Approach 2:
Different regions of the adhesive system have different properties tailored to specific functions. The first adhesive layer is formulated with specific adhesion strength for secure bonding, while the second adhesive layer has different composition and properties optimized for controlled release. This local differentiation of adhesive properties enables simultaneous achievement of strong attachment and precise, damage-free release
2Reliability
If strong adhesion is used to secure chips to substrate during transportation, then chips do not shift or detach, but chips cannot be easily removed or transferred to another substrate
Solution Approach 1:
The adhesive system is divided into two distinct layers: the first adhesive layer provides strong bonding for secure chip attachment and positioning stability during transportation, while the second adhesive layer is designed with different properties to enable easy chip removal and transfer. This segmentation allows the system to provide both strong holding force and easy release capability
Solution Approach 2:
The adhesive system transitions from a static strong-bonding state to a dynamic release state through the sequential removal of adhesive layers. The first layer maintains strong adhesion during transport, then the second layer is removed to enable chip release, allowing the system to adapt its adhesion characteristics to different operational phases
3Ease of operation
If weak adhesion is used to facilitate chip release, then chips can be easily removed, but chips may shift or detach during transportation and processing
Solution Approach 1:
The adhesive system is segmented into two layers with complementary functions: the first adhesive layer provides strong bonding to prevent chip shifting or detachment during transportation and processing, while the second adhesive layer is designed with weaker or more easily removable properties to facilitate chip release when needed
Solution Approach 2:
The adhesive system dynamically adjusts its effective adhesion strength through the sequential removal of adhesive layers. The first layer provides strong adhesion during transport, then the second layer is removed to enable easy chip release, allowing the system to provide both strong attachment and easy release at different operational stages
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures strong attachment during transportation and processing while minimizing damage to the chips, enabling reliable transfer of semiconductor devices without misalignment.
Implementation Method 1
The polymer layer is then dried, such as by evaporation
Implementation Method 2
softening the first adhesive layer
Data Source
AI summary
One or more chips are transferred from one substrate to another by using one or more polymer layers to secure the one or more chips to an intermediate carrier substrate. While secured to the intermediate carrier substrate, the one or more chips may be transported or put through further processing or fabrication steps. To release the one or more chips, the adhesion strength of the one or more polymer layers is gradually reduced to minimize potential damage to the one or more chips.