Conductive Polymer Error Compensation Layer for EUVL Misalignment
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Solution Overview
Problem
In modern semiconductor devices, pattern placement errors due to off-axis illumination in extreme ultraviolet light lithography lead to misalignment of interconnect lines, compromising device performance by reducing the available floor space and increasing the risk of shorting between conductive features.
Innovation Solution
A pattern placement error compensation layer is formed using a conductive polymer layer with a conductive path length less than the spacing between conductive features, which is deposited above a dielectric layer and used to create vias that contact the underlying conductive features, thereby lowering net contact resistance and mitigating alignment errors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If off-axis illumination is used in EUVL, then lithography capability is improved, but pattern placement accuracy deteriorates due to telecentricity and shadowing errors
Solution Approach 1:
A conductive polymer layer is introduced as an intermediary between the first conductive feature and the conductive via. This intermediate layer compensates for pattern placement errors by providing a conductive path that bridges misaligned features, thereby maintaining electrical connectivity despite telecentricity and shadowing errors caused by off-axis illumination
Solution Approach 2:
The conductive polymer layer's electrical conductivity parameter is utilized to compensate for alignment errors. By controlling the conductive path length to be less than the spacing between conductive features, the layer provides sufficient electrical connectivity while maintaining the ability to bridge misaligned patterns
2Manufacturing precision
If conductive polymer layer is added to compensate for alignment errors, then pattern placement error compensation is improved, but device complexity increases
Solution Approach 1:
The conductive polymer layer serves multiple functions simultaneously: it acts as a conductive interconnect, provides pattern placement error compensation, and maintains electrical isolation between features through controlled conductivity. This multi-functionality reduces the need for additional separate components
3Reliability
If conductive polymer layer with conductive path length less than spacing between features is used, then electrical isolation between features is maintained, but contact resistance increases
Solution Approach 1:
The conductive polymer layer's conductivity and path length parameters are optimized to balance electrical isolation and contact resistance. By setting the conductive path length to be less than the spacing between conductive features, the layer provides sufficient conductivity for low contact resistance while maintaining adequate electrical isolation between adjacent features
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The conductive polymer layer effectively reduces the impact of pattern placement errors by providing a conductive path for current flow, maintaining electrical isolation between features and improving device performance by reducing contact resistance.
Implementation Method 1
The conductive polymer layer has a conductive path length. A conductive via is formed in the first via opening. The conductive via contacts the first conductive feature and the conductive polymer layer
Data Source
AI summary
A method includes forming a first conductive feature positioned in a first dielectric layer. A conductive polymer layer is formed above the first dielectric layer and the first conductive feature. The conductive polymer layer has a conductive path length. A second dielectric layer is formed above the first dielectric layer. A first via opening is formed in the second dielectric layer and the conductive polymer layer to expose the first conductive feature. A conductive via is formed in the first via opening. The conductive via contacts the first conductive feature and the conductive polymer layer.