Multilayer Polymer Composite Encapsulation for Flat Embedded Components
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Solution Overview
Problem
Existing multilayer polymer composite devices with enclosed components face challenges such as void formation, complex manufacturing processes, and difficulty in maintaining flat surfaces due to the spatial extent of embedded components, which affect durability and mechanical strength, and require precise temperature control to avoid component damage.
Innovation Solution
A multilayer polymer composite device with distinct thermoplastic layers having different softening temperatures, where an inner layer with a lower softening temperature liquefies to encapsulate components, simplifying temperature control and eliminating the need for additional fillers or adhesives, while overheating protection layers safeguard sensitive components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional hot lamination processes are used to produce multilayer polymer composite devices, then the polymer layers can be bonded together, but the high temperatures and pressures required can damage the enclosed or to-be-enclosed components
Solution Approach 1:
The polymer composite device is divided into multiple layers with different softening temperatures. The first polymer layer has a lower softening temperature suitable for heat-sensitive components, while the second polymer layer has a higher softening temperature for structural integrity. This segmentation allows each layer to be processed at appropriate temperatures, bonding the layers together without damaging enclosed components.
2Shape
If recesses are precisely punched to correspond to the geometry of components to be enclosed, then flat surfaces can be achieved, but the manufacturing process becomes very complex and requires high precision
Solution Approach 1:
Instead of precisely punching recesses matching component geometries, the invention changes the approach by using polymer layers with different softening temperatures. The first polymer layer is softened at a lower temperature to conform to and encapsulate components, automatically compensating for their spatial extent and creating flat surfaces without complex punching operations.
3Strength
If filler or adhesive is introduced into recesses to prevent void formation, then mechanical strength is improved, but the manufacturing process requires additional steps and temperature control becomes difficult
Solution Approach 1:
The invention uses a composite structure of two polymer layers with different softening temperatures. The first polymer layer (with lower softening temperature) acts as both the bonding agent and the encapsulating material, eliminating the need for separate fillers or adhesives. This composite approach simplifies the manufacturing process while maintaining mechanical strength and preventing void formation.
4Object-affected harmful factors
If the softening point of filler or adhesive is kept below the temperature threshold to avoid component damage, then components are protected, but uniform thermal activation becomes challenging due to thermal insulation by surrounding polymer material
Solution Approach 1:
The invention applies local quality by having different polymer layers with different softening temperatures in different locations/positions. The first polymer layer in contact with heat-sensitive components has a lower softening temperature, allowing it to be activated at lower temperatures where uniform heating is easier to achieve, while the second polymer layer has a higher softening temperature for structural support.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution facilitates simplified manufacturing by reducing the number of process steps and components, ensures flat surfaces, and protects sensitive components from overheating and pressure, enhancing durability and mechanical strength.
Implementation Method 1
The third softening temperature is lower than both the first and second softening temperatures. The first and second cover layers are arranged in relation to the inner layer
Data Source
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AI summary
A polymer composite device comprises a first thermoplastic covering layer of a polymer material with a first softening temperature and a second thermoplastic covering layer of a polymer material with a second softening temperature. The polymer composite device also comprises a carrier layer, which is arranged between the first covering layer and the second covering layer. An inner layer, which comprises at least a first thermoplastic inner layer ply of a polymer material with a third softening temperature, is arranged between the first covering layer and the second covering layer. The inner layer at least partially surrounds the carrier layer in a material-bonding manner. The third softening temperature is lower than the first softening temperature and lower than the second softening temperature.