Polymer Conductive Interconnects for Strain-Absorbing Adhesive Layers
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Solution Overview
Problem
Conventional methods for electrical contact-connection of components to carrier elements in microelectronics are limited by the thickness of the adhesive layer, which restricts the absorption of mechanical strains, particularly in sensitive components like sensors, due to the use of metallic bonding wires that require ultrasound friction welding, limiting adhesive thickness and increasing stress during temperature cycles.
Innovation Solution
The use of polymer-containing, electrically conductive connecting elements that extend over the lateral area of the component, allowing for thicker adhesive layers and improved stress absorption by coordinating the material properties of the adhesive, connecting element, and potting composition to match the component's thermal expansion and modulus of elasticity, thereby reducing mechanical stresses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the adhesive layer is thickened to absorb mechanical strains, then the absorption of lateral and bending forces is improved, but the conventional electrical contact-connection methods using metallic bonding wires limit the maximum achievable adhesive thickness
Solution Approach 1:
The patent changes the material parameter of the electrical connection from metallic bonding wire to polymer-containing connecting element, which allows the adhesive layer thickness to be increased beyond conventional limits while maintaining electrical conductivity. This parameter change enables the adhesive layer to be thickened for better mechanical strain absorption without being constrained by the requirements of ultrasonic wire bonding.
Solution Approach 2:
The patent employs composite materials by using polymer-containing connecting elements that combine the electrical conductivity of metals with the flexibility and strain-absorption capabilities of polymers. This composite approach allows the electrical connection to accommodate thicker adhesive layers while maintaining both electrical functionality and mechanical strain absorption.
2Reliability
If the adhesive layer is thickened to reduce mechanical stresses, then the protection of sensitive components is improved, but the coordination of material properties becomes more complex
Solution Approach 1:
The patent changes the material parameters of the connecting element to match the thermal expansion and modulus of elasticity of the component and carrier element. By selecting polymer-containing materials with coordinated parameters, the system achieves better stress distribution and reduced mechanical stresses on sensitive components during temperature cycles.
Solution Approach 2:
The patent applies the principle of homogeneity by ensuring that the material properties of the adhesive, connecting element, and potting composition are coordinated and matched to the component's thermal expansion and modulus of elasticity. This creates a more homogeneous stress distribution across the interface, reducing localized stresses and improving component protection.
3Reliability
If metallic bonding wires are used for electrical contact-connection, then the electrical connectivity is achieved, but the ultrasound friction welding process limits the adhesive layer thickness
Solution Approach 1:
The patent replaces the mechanical ultrasonic wire bonding system with a polymer-containing connecting element that can be applied using different methods. This substitution eliminates the constraint of ultrasonic welding on adhesive thickness, allowing for thicker adhesive layers while maintaining electrical connectivity through the conductive polymer material.
Solution Approach 2:
The patent changes the material state and properties of the electrical connection from solid metallic wire requiring ultrasonic welding to polymer-containing material that can accommodate thicker adhesive layers. This parameter change in material selection and physical state enables increased adhesive thickness without compromising electrical connectivity.
Data Source
AI summary
The invention relates to a module having a carrier element with electrical contact elements and a component applied to the carrier element with electrical connections on the side remote from the carrier element. The electrical connections of the component are electrically connected to contact elements of the carrier element via polymer-containing connecting elements.