Thermosetting Polymer Curing Measurement Using FBG and Dielectric Sensing
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Solution Overview
Problem
Thermosetting polymers experience property changes during solidification, leading to defects such as warpage and breakage due to unpredictable changes, necessitating accurate measurement methods.
Innovation Solution
An apparatus and method using fiber Bragg grating (FBG) and dielectric constant sensors to measure properties like elastic modulus, chemical shrinkage, and hardening degree during polymer solidification, with a processor analyzing data from these sensors to determine properties accurately.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If thermosetting polymers are used in semiconductor packaging, then various functional benefits are achieved, but property changes during solidification cause defects such as warpage and breakage
Solution Approach 1:
The patent applies preliminary action by measuring polymer properties (elastic modulus, chemical shrinkage, degree of hardening) during the solidification process using FBG and dielectric constant sensors. This early detection of property changes allows prediction of warpage and breakage before they occur, enabling preventive measures to be taken during manufacturing rather than dealing with defects after product completion.
2Productivity
If property changes during solidification are not accurately predicted, then manufacturing efficiency is maintained, but defects such as warpage and breakage occur
Solution Approach 1:
The patent implements feedback by continuously monitoring polymer properties during solidification using sensors and processors. The measured data on elastic modulus, chemical shrinkage, and degree of hardening provides real-time feedback about the solidification state, allowing dynamic adjustment of processing parameters to prevent defects while maintaining manufacturing efficiency.
3Measurement precision
If multiple sensors (FBG and dielectric constant) are used to measure polymer properties, then measurement precision is improved, but device complexity increases
Solution Approach 1:
The patent merges two different sensing technologies (FBG sensors for strain/length measurements and dielectric constant sensors for hardness measurements) into a single integrated measurement system. This combination allows simultaneous measurement of multiple polymer properties (elastic modulus, chemical shrinkage, degree of hardening) using a unified apparatus with coordinated sensors and processors, improving measurement precision while managing system complexity through integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Accurately measures properties of thermosetting polymers post-gel point, reducing defects in products like semiconductor packages by predicting changes and ensuring product integrity.
Implementation Method 1
A first fiber Bragg grating (FBG) sensor is within the first chamber, a second FBG sensor is within the second chamber
Implementation Method 2
generate wavelength data representing changes in a wavelength of light, caused by solidification of the thermosetting polymer
Implementation Method 3
a first dielectric constant sensor is within the first chamber, and a second dielectric constant sensor is within the second chamber
Implementation Method 4
A sensor unit is within the chamber and includes an FBG sensor, a temperature sensor, and a dielectric constant sensor
Data Source
AI summary
An apparatus for measuring properties of a thermosetting polymer includes a body having a first chamber and a second chamber each filled with the thermosetting polymer material. A first FBG sensor is disposed in the polymer material within the first chamber and a second FBG sensor is disposed in the polymer material within the second chamber. A first dielectric constant sensor is in the first chamber, and a second dielectric constant sensor is in the second chamber. A computing device is configured to measure properties of the thermosetting polymer based on wavelength data measured using the first FBG sensor and the second FBG sensor, and a loss coefficient of the polymer material measured using the first dielectric constant sensor and the second dielectric constant sensor, while the thermosetting polymer solidifies in the first chamber and the second chamber.