Thermoplastic Polymer Encapsulation for Photovoltaic Modules
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Solution Overview
Problem
Existing encapsulation processes for photovoltaic cells and other optoelectronic components often degrade these components due to high temperatures, require organic solvents, and involve complex steps, posing industrial and environmental safety risks, and do not ensure strong adhesion between components and protective layers.
Innovation Solution
A method for determining the crystallization delay of semi-crystalline thermoplastic polymers using differential scanning calorimetry, allowing for their use in encapsulation processes at lower temperatures, ensuring the polymer remains in a molten state and maintains adhesion without degrading the components, using a polyamide graft polymer with a polyolefin backbone and unsaturated monomers for improved thermal and rheological properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional encapsulation processes are used, then strong adhesion between components and protective layers is achieved, but component degradation occurs due to high temperatures
Solution Approach 1:
The patent changes the thermal parameters of the encapsulation process by using a polymer composition with specific glass transition temperature (Tg) and melting temperature (Tm) characteristics. The composition is designed to remain above its Tg during encapsulation, providing adhesion at lower temperatures (below 130°C) that do not degrade sensitive photovoltaic components while still achieving strong bonding.
Solution Approach 2:
The patent utilizes the phase transition properties of the polymer composition, specifically maintaining it in a rubbery state above its glass transition temperature but below its melting temperature. This phase state provides optimal adhesion characteristics during encapsulation while avoiding the high-temperature degradation issues of conventional processes.
2Strength
If high temperature encapsulation is used, then strong adhesion is achieved, but organic solvents and complex process steps are required
Solution Approach 1:
The patent extracts and eliminates the need for organic solvents from the encapsulation process. The polymer composition is designed to provide adequate adhesion and processing characteristics without requiring solvent-based applications, thereby simplifying the process and eliminating environmental and safety concerns associated with organic solvents.
Solution Approach 2:
The patent employs a thermoplastic polymer composition that can be applied and cured in a single step without requiring complex multi-step processes. The material is designed to be processed directly in its solid or melted state, eliminating the need for solvent evaporation, crosslinking catalysts, or multiple curing stages.
3Strength
If high temperature encapsulation is used, then adhesion is improved, but environmental and industrial safety risks increase
Solution Approach 1:
The patent changes the temperature parameters of the encapsulation process by designing a polymer composition with appropriate Tg and Tm values that enable effective adhesion at temperatures below 130°C. This reduces the thermal energy required for processing, thereby eliminating safety risks associated with high-temperature operations while maintaining adhesion strength.
Solution Approach 2:
The patent uses a simplified polymer composition that does not require hazardous additives, crosslinking agents, or solvent systems. The material can be processed and cured in a single step at low temperatures, eliminating the need for complex safety infrastructure and reducing industrial and environmental risks.
4Strength
If conventional encapsulation processes are used, then adhesion is achieved, but the process involves multiple complex steps
Solution Approach 1:
The patent merges multiple process steps into a single encapsulation operation. The polymer composition is designed to provide both adhesion and protective functions in one application step, eliminating the need for separate priming, bonding, and curing operations required by conventional processes.
Solution Approach 2:
The patent employs a polymer composition that achieves full adhesion and curing in a single step without requiring multiple processing stages. The material is designed to be applied and activated simultaneously, eliminating the need for separate processing steps and improving overall production efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for effective encapsulation of sensitive components at temperatures below 130°C, ensuring strong adhesion and minimizing environmental impact, while simplifying the process and reducing the risk of component degradation.
Implementation Method 1
heating the semi-crystalline thermoplastic polymer to a temperature T1 such that T1>Tf1
Implementation Method 2
cooling the thermoplastic polymer thus heated from the temperature T1 to a temperature T2
Data Source
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AI summary
The invention relates to a method for determining a delay in the crystallisation of a semi-crystalline thermoplastic polymer having a melting point Tf1. The method comprises: (a) a first step of heating the semi-crystalline thermoplastic polymer to a temperature T1, such that Tf1 < T1; (b) a step of cooling the semi-crystalline thermoplastic polymer obtained in step (a) from T1 to a temperature T2 , such that T2 < Tf1; (c) a second step of heating the semi-crystalline thermoplastic polymer obtained in step (b) from T2 to T1; and, optionally, (d) repeating, at least once, step (b) from T1 to a temperature T and step (c) from T to T1, with T2 ≤ T, the delay in the crystallisation of the polymer being observed as soon as DSC monitoring reveals the absence of a crystallisation peak during step(s) (b) and the absence of a melting peak during step(s) (c) at temperature TEF , such that T ≤ TEF ≤ Tf1. The invention also relates to the use of such a polymer for coating or encapsulating at least one (opto)electronic component, as well as to a method for coating or encapsulating such components. The invention further relates to an assembly obtained using said coating or encapsulation method, to a photovoltaic module comprising such an assembly, and to a method for producing such a module.