Polymer Film Layer B Inflection Point Wiring Distortion
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Solution Overview
Problem
Existing polymer films used in circuit boards suffer from wiring distortion during lamination due to stress, which is not effectively addressed by current materials.
Innovation Solution
A polymer film with a layer A containing a polymer with a dielectric loss tangent of 0.01 or less and a layer B with an additive that has an inflection point in elastic modulus change due to temperature or deformation rate, or reduced elastic modulus under pressurization, enhancing followability and reducing stress during lamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a polymer film is used for circuit board insulation, then dielectric loss is reduced, but wiring distortion occurs during lamination due to stress
Solution Approach 1:
The patent changes the physical and chemical parameters of the polymer film by incorporating a specific layer structure with additives that exhibit inflection points in elastic modulus. This allows the material to transition from a rigid state during storage to a soft, conformable state during lamination, reducing wiring distortion while maintaining low dielectric loss properties
Solution Approach 2:
The patent creates a composite polymer film structure consisting of multiple layers with different functional properties. Layer A provides the base polymer matrix with low dielectric loss, while Layer B contains additives that modify mechanical properties during processing. This composite structure enables simultaneous achievement of low dielectric loss and reduced wiring distortion
2Strength
If a rigid polymer film is used to maintain structural integrity, then strength is improved, but followability during lamination deteriorates
Solution Approach 1:
The patent introduces dynamic characteristics to the polymer film by incorporating additives that respond to temperature and pressure changes. The film transitions from a rigid state at room temperature to a soft, adaptable state during lamination processing, then returns to rigidity after cooling, achieving both strength and followability at different stages
Solution Approach 2:
The patent prepares the polymer film in advance with embedded additives that will activate under specific lamination conditions. The additives are pre-positioned to soften the film at the moment of lamination, ensuring optimal followability when needed, while maintaining structural integrity during handling and storage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The polymer film effectively suppresses wiring distortion by rapidly softening under temperature and pressure, improving adherence and reducing stress during lamination, thereby enhancing the lamination process.
Implementation Method 1
the layer B contains an additive which is compatible with the polymer having a dielectric loss tangent of 0.01 or less at 25° C. and is to be phase-separable from the polymer having a dielectric loss tangent of 0.01 or less by heating
Implementation Method 2
The polymer film effectively suppresses wiring distortion by rapidly softening under temperature and pressure
Implementation Method 3
the layer B has an inflection point in a change in elastic modulus due to a change in temperature or a change in deformation rate
Data Source
AI summary
Provided are a polymer film including a layer A and a layer B on at least one surface of the layer A, in which the layer A contains a polymer having a dielectric loss tangent of 0.01 or less or at least one polymer A selected from the group consisting of a liquid crystal polymer, a fluorine-based polymer, a polymerized substance of a compound which has a cyclic aliphatic hydrocarbon group and a group having an ethylenically unsaturated bond, a polyphenylene ether, and an aromatic polyether ketone, the layer B contains an additive, and the layer B has an inflection point in a change in elastic modulus due to a change in temperature or a change in deformation rate, or has a reduced elastic modulus under pressurization; a laminate using the polymer film; and a method for manufacturing the same.