Polymer Film Sensor Cavities for Smaller Multi-Sensor Packages
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Solution Overview
Problem
Existing sensor packages are limited by inefficiencies in manufacturing, particularly in creating small sensor cavities, which restricts package size and the number of sensors that can be incorporated.
Innovation Solution
The use of a polymer film member coupled to a solid member, positioned within a mold chase, allows for the creation of miniature sensor cavities without the need for photosensitive polymer films or photo processing techniques, enabling multiple sensors in a single package without increasing size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional molding techniques are used to create sensor cavities, then manufacturing process is simpler, but sensor cavity size cannot be minimized and multiple sensors cannot be incorporated
Solution Approach 1:
The polymer film member is pre-formed and coupled to the solid member before the molding process. This preliminary preparation allows the sensor cavity to be created in advance within the mold chase, enabling the molding process to simply encapsulate the pre-assembled components without requiring complex post-processing or specialized cavity formation techniques.
Solution Approach 2:
The solid member acts as an intermediary tool that holds the polymer film member in place during the molding process. It facilitates the creation of the sensor cavity by providing a temporary structure that defines the cavity shape, which is then removed after molding to leave the desired sensor cavity. This intermediary approach simplifies the molding process while enabling precise cavity formation.
2Manufacturing precision
If photosensitive polymer films and photo processing techniques are used, then sensor cavity precision is improved, but manufacturing cost increases
Solution Approach 1:
The solid member is used as a disposable or temporary tool that is removed after serving its purpose in defining the sensor cavity during molding. This approach replaces expensive photo processing techniques with a simpler, cost-effective method where the solid member's only function is to facilitate cavity formation during the molding process, then it is discarded.
Solution Approach 2:
The invention changes the fundamental approach from using photosensitive materials requiring optical processing to using conventional polymer films with mechanical molding. This parameter change in the manufacturing method eliminates the need for expensive photo processing equipment and materials while achieving the same precision through mechanical means.
3Quantity of substance
If sensor cavity size is reduced to minimize package size, then number of sensors that can be incorporated increases, but manufacturing difficulty increases
Solution Approach 1:
The polymer film member is segmented or configured to accommodate multiple sensor cavities simultaneously. By dividing the film structure to create multiple separate cavity regions, the invention enables multiple sensors to be incorporated in a single package while maintaining simple manufacturing processes, as each cavity is formed independently during the molding operation.
Data Source
AI summary
In examples, a sensor package includes a semiconductor die, a sensor on the semiconductor die, and a mold compound covering the semiconductor die. The mold compound includes a sensor cavity over the sensor. The sensor package includes a polymer film member on the sensor and circumscribed by a wall of the mold compound forming the sensor cavity. The polymer film member is exposed to an exterior environment of the sensor package.