Photosensitive Resin Polymer for Fine Patterning and Strong Low-Temp Films
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Solution Overview
Problem
Current photosensitive resin compositions struggle to achieve high resolution, fine pattern formation, and excellent mechanical characteristics, especially when cured at low temperatures, for interlayer insulating and surface protective films in semiconductor devices.
Innovation Solution
A polymer with specific structural units, represented by general formulas (1), (2), (3), and (4), is used as a base resin for positive and negative photosensitive resin compositions. These compositions are soluble in aqueous alkaline solutions, enabling fine pattern formation and high resolution, while maintaining excellent mechanical properties even when cured at low temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a closed-ring polyimide resin is used to lower post-curing temperature, then curing temperature is reduced, but mechanical characteristics (elongation and tensile strength) and adhesion deteriorate
Solution Approach 1:
The patent uses a composite polymer structure combining aromatic rings (for heat resistance and mechanical strength) with aliphatic chains (for flexibility and elongation). Specifically, the polymer contains repeating units with both rigid aromatic segments and flexible aliphatic segments, creating a composite material that achieves both low curing temperature and excellent mechanical properties simultaneously
Solution Approach 2:
The patent modifies the polymer structure by changing the ratio and arrangement of aromatic and aliphatic components. By adjusting the molecular structure parameters (introducing flexible aliphatic chains between rigid aromatic rings), the material achieves lower glass transition temperature and curing temperature while maintaining or improving mechanical strength and adhesion properties
2Strength
If ester-diamine-containing polybenzoxazole precursor is used to improve mechanical strength, then tensile strength increases, but pattern resolution and lithography characteristics deteriorate
Solution Approach 1:
The patent applies local quality by positioning specific functional groups at different locations within the polymer chain. Aromatic rings with rigid structures are placed to provide mechanical strength in specific regions, while flexible aliphatic chains are positioned to enable solubility and pattern formation in other regions, achieving both high strength and high resolution simultaneously
3Stability of the object's composition
If flexible diamine is incorporated to improve elongation, then mechanical flexibility increases, but overall mechanical strength and adhesion deteriorate
Solution Approach 1:
The patent merges rigid aromatic segments and flexible aliphatic segments into a single integrated polymer chain structure. The aromatic rings provide strength and heat resistance, while the aliphatic chains provide flexibility and elongation, with both components working synergistically to achieve superior overall performance that neither component could achieve alone
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution allows for the formation of cured films with improved adhesiveness, heat resistance, electrical properties, mechanical strength, and chemical resistance, enhancing the reliability of semiconductor devices.
Implementation Method 1
suitable interaction between molecules is promoted by the general formula (1) or (2) having a phenyl group having a substituent, so that the polymer is usable as a base resin of a photosensitive resin composition having excellent mechanical properties even when cured at low temperatures
Implementation Method 2
The polymer is soluble in an aqueous alkaline solution by the general formula (3) or (4) having a phenolic hydroxy group, so that a fine pattern can be formed and high resolution can be achieved
Data Source
AI summary
The present invention is a polymer containing: a structural unit of general formula (1) and/or (2); and a structural unit of general formula (3) and/or (4), where X1 represents a tetravalent organic group, R1 to R4 each represent a monovalent organic group or a hydrogen atom, provided that at least one is a monovalent organic group, L represents a divalent organic group or a divalent atom, X2 represents a divalent organic group, X3 represents a tetravalent organic group, “s” represents 0 or 1, Z represents a divalent bonding group, and X4 represents a divalent organic group. This provides a polymer soluble in an aqueous alkaline solution and usable as a base resin for positive and negative photosensitive resin compositions which enable fine pattern formation, provide high resolution, and have excellent mechanical characteristics even when cured at low temperatures.