Polymer Capacitive Force Sensor With PCB-Integrated Electrodes
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Solution Overview
Problem
Conventional force sensors require additional connectors to connect drive and sensing electrodes to a circuit board, complicating the manufacturing process and increasing costs.
Innovation Solution
The drive and sensing electrodes are directly integrated onto a circuit board during manufacturing, with a polymer material layer that changes dielectric constant upon pressure, allowing capacitive force detection without additional connectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If additional connectors are used to connect drive and sensing electrodes to circuit board, then electrical connection reliability is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the force sensor module with the circuit board by directly forming drive and sensing electrodes on the circuit board surface. This integration eliminates the need for separate connectors, reducing device complexity while maintaining electrical connection reliability through direct trace routing on the circuit board.
Solution Approach 2:
The circuit board serves multiple functions: it provides both the electrical connection pathway and the structural mounting surface for the force sensor. The drive and sensing electrodes are formed directly on the circuit board, making the circuit board a multi-functional component that eliminates the need for separate connector components.
2Reliability
If additional connectors are used to connect drive and sensing electrodes to circuit board, then electrical connection reliability is improved, but manufacturing cost increases
Solution Approach 1:
The patent combines the force sensor electrodes with the circuit board manufacturing process. Drive and sensing electrodes are formed directly on the circuit board using standard PCB trace formation techniques, eliminating the need for separate connector components and reducing manufacturing steps, which lowers production cost while maintaining connection reliability.
Solution Approach 2:
The circuit board performs its own electrical connection function by incorporating drive and sensing electrodes directly on its surface. This self-service approach eliminates the need for external connectors, reducing component count and assembly complexity, thereby lowering manufacturing cost while ensuring reliable electrical connections.
3Ease of repair
If polymer material layer is made attachable and detachable repeatedly, then ease of repair and replacement is improved, but adhesive layer reliability may deteriorate
Solution Approach 1:
The patent employs a dynamic adhesive layer that can be repeatedly attached and detached. The adhesive layer is designed with specific material properties that allow it to maintain reliable bonding during multiple attachment-detachment cycles, enabling easy repair and replacement of the polymer material layer while preserving connection reliability through careful material selection and formulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process and reduces costs by eliminating the need for connectors, while enabling reliable force detection through capacitive changes in the polymer material layer.
Implementation Method 1
When the polymer material layer is pressed, a dielectric constant thereof is changed accordingly
Data Source
AI summary
There is provided a force sensor including a substrate and a polymer material layer. The substrate has a circuit layout that includes a first electrode and a second electrode configured to form a capacitor therebetween. The polymer material layer covers at least on a space between the first electrode and the second electrode, and is used to change capacitance of the capacitor while being pressed.